Silicon Wafer Edge Grinding Machine for Microelectronics
Price
Min. Order Reference FOB Price
1 Piece US$7,000.00 / Piece
Sepcifications
- After-sales Service Available
- Warranty 1 Year
- Automatic Automatic
- Style Desktop
- Certification GS, CE, ISO
- Transport Package Custom
- Specification 1560x700x940mm
- Trademark N/A
- Origin China
- Power (Kw) 2
- Weight (Kg) 350
- Grinding Disc Size 4 Inches
- Workpiece Size 3-6 Inches
- Grinding Wheel Speed 0-4500rpm Adjustable
- Wafer Center Positioning Accuracy ≤±0.1mm
- Vacuum Chuck Repeatability ≤±0.01mm
- Minimum Vacuum Disc Movement Step <±0.01mm
- Grinding Speed 1mm/S-50mm/S
- Adhesion Force Better Than -80kpa
- Main Motor Speed 0-90rpm
Product Description
Production process Can build a complete silicon wafer production line Equipment Principle The equipment utilizes a high-speed rotating grinding head to chamfer the edges of the wafer. The wafer is placed and fixed on a vacuum chuck. By inputting parameters such as the wafer's dimensions, the CNC ...
