| Specification |
Type: Package Material;
Usage: Combustible & Explosive Area, Computer Room, Electronic Component Maintenance Room, Printing Workshop, SMT Production Line;
Product Name: Conductive ESD Box with Lid for Storing SMD Compon;
Product Material: Conductive PP Compound;
Color: Black;
Outer Size: 340*240*30;
Inner Size: 325*225*20;
Surface Resistance: 10e4-10e9 Ohm;
Net Weight: 2kg;
Use: Storage;
OEM: Yes;
Sample: Yes;
Condition: New;
Waterproof: Waterproof;
Print: Yes;
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Type: Bag;
Usage: Combustible & Explosive Area, Computer Room, Electronic Component Maintenance Room, Printing Workshop, SMT Production Line;
Thickness: Shielding Film (37 Micron), Bubble Height 3mm;
Appearance: Silver & Pink Transparent;
Performances: Shockproof Usage, Waterproof, Moisture Protection;
Surface Resistance: 10e7 ~ 10e10 Ohm;
Application: Electronic Inducstries, SMT Production;
Feature: Antistatic, Shock Resistance;
Material: APET/CPP & PE;
Shape: Seal Bag;
Making Process: Composite Packaging Bag;
Raw Materials: High Pressure Polyethylene Plastic Bag;
Bag Variety: Back Seal Bags;
|
Type: Bag;
Usage: Combustible & Explosive Area, Computer Room, Electronic Component Maintenance Room, Printing Workshop, SMT Production Line;
Thickness: Shielding Film (37 Micron), Bubble Height 3mm;
Appearance: Silver & Pink Transparent;
Performances: Shockproof Usage, Waterproof, Moisture Protection;
Surface Resistance: 10e7 ~ 10e10 Ohm;
Application: Electronic Inducstries, SMT Production;
Feature: Antistatic, Shock Resistance,;
Material: APET/CPP & PE;
Shape: Seal Bag;
Making Process: Composite Packaging Bag;
Raw Materials: High Pressure Polyethylene Plastic Bag;
Bag Variety: Back Seal Bags;
|
Type: Bag;
Usage: Combustible & Explosive Area, Computer Room, Electronic Component Maintenance Room, Printing Workshop, SMT Production Line;
Thickness: Shielding Film (37 Micron), Bubble Height 3mm;
Appearance: Silver & Pink Transparent;
Performances: Shockproof Usage, Waterproof, Moisture Protection;
Surface Resistance: 10e7 ~ 10e10 Ohm;
Application: Electronic Inducstries, SMT Production;
Feature: Antistatic, Shock Resistance;
Material: APET/CPP & PE;
Shape: Seal Bag;
Making Process: Composite Packaging Bag;
Raw Materials: High Pressure Polyethylene Plastic Bag;
Bag Variety: Back Seal Bags;
|
Type: Bag;
Usage: Combustible & Explosive Area, Computer Room, Electronic Component Maintenance Room, Printing Workshop, SMT Production Line;
Thickness: Shielding Film (37 Micron), Bubble Height 3mm;
Appearance: Silver & Pink Transparent;
Performances: Shockproof Usage, Waterproof, Moisture Protection;
Surface Resistance: 10e7 ~ 10e10 Ohm;
Application: Electronic Inducstries, SMT Production;
Feature: Antistatic, Shock Resistance;
Material: APET/CPP & PE;
Shape: Seal Bag;
Making Process: Composite Packaging Bag;
Raw Materials: High Pressure Polyethylene Plastic Bag;
Bag Variety: Back Seal Bags;
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