What is Direct Copper Bonding On Metalized Electronic Ceramics Plate For Power Module Substrates
Price
Min. Order Reference FOB Price
1 Piece US$20.00 / Piece
Sepcifications
- Dielectric Aln , Ausn, Ni, Cu
- Transport Package Carton
- Specification Customized
- Trademark Adena Ceramic
- Origin China
- Material Alumina Nitride
- Metal Material Au, Sn, Ni, Cu and So on
- Package Plastic Box
- Thermal Conductivity High
- Encapsulation CPU/GPU
Product Description
Specification Item Unit 96% Al2O3 High Reflective96 Al2O3 ZTAAl2O3+ZrO2 AIN Color - White/Black White White Grey Cost - N 3N 4N 7N Surface Roughness um 0.1~0.3 0.1~0.25 0.0.5~0.15 0.5~0.6 Density g/cm3 3.72 3.65 4.0 3.3 Grain Size Average um 3~4 1~3 1~3 2~4 Flexure Strength MPa 300~500 300~500 ...
