| Specification |
Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Item No: PCB Assembly;
Place of Origin: China;
Service: One Stop Service;
Material: Fr4 Cem1 Hight Tg, FPC, Alum;
Testing: PCB Test, PCBA Function Test, Aoi Test;
Layer: 1-48;
Copper Thickness: 1oz, 2oz, 3oz;
Board Type: Rigid PCBA, Filexible PCBA, Metal PCBA, Gold Plate;
Surface Finish: HASL, Enig, Immersion Gold, Immersion Silver;
Funtion Test: 100 % Functional Test;
PCBA Testing: X-ray, Aoi Test, Functional Test;
PCBA Color: Green, White, Black, Red, Blue;
Application: Electronics Device;
Testing Service: 100%;
Board Thickness: 0.2mm-7.0mm;
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Metal Coating: Gold;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
Item: Fr4 1.6mm PCB Android Phone PCB Android Phone PCB;
Layer: 1-22;
Surface Finishing: HASL, Enig, OSP, Immersion Au, AG, Sn;
Min.Hole Size: 0.1mm;
Min.Line Spacing: 3 Mil;
PCBA QC: X-ray, Aoi Test, Function Test(100% Test);
Specialised: LED, Medical, Industrial, Control Board;
Delivery: PCB, 7-10 Days;PCBA, 2-3weeks;
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Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
PCB Soldermask: Green;
PCB Silkscreen: White;
PCB Thickness: 0.6mm;
PCB Layer: 4 Layers;
Surface Finished: HASL Lead Free;
Copper Thickness: 1oz Copper;
PCB Materials: RF4 Tg170;
PCBA Mini Footprint: 01005;
IC: BGA;
IC Type: Qfn;
PCB Type: Rigid PCB;
PCB Tg: Tg;
Aoi: 100% Checking;
BGA: X-ray 100% Testing;
SMT Mini Size: 01005;
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Metal Coating: Copper/Tin/Gold/Silver/HASL/OSP/Enig;
Mode of Production: SMT and DIP;
Layers: Multilayer;
Base Material: Fr-4/ High Tg Fr-4/ Aluminum/ Ceramic/ Copper/ Hal;
Customized: Customized;
Condition: New;
Service: PCB+Assembly+Components;
Solder Mask Color: White.Black.Yellow.Green.Red.Blue;
Testing Service: Electrical Testing,Flying Probe Tester,Functional;
Min. Hole Size: 0.15mm;
Min. Line Spacing: 0.075---0.09mm;
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Metal Coating: Gold;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
Item: Fr4 1.6mm PCB Android Phone PCB Android Phone PCB;
Layer: 1-22;
Surface Finishing: HASL, Enig, OSP, Immersion Au, AG, Sn;
Min.Hole Size: 0.1mm;
Min.Line Spacing: 3 Mil;
PCBA QC: X-ray, Aoi Test, Function Test(100% Test);
Specialised: LED, Medical, Industrial, Control Board;
Delivery: PCB, 7-10 Days;PCBA, 2-3weeks;
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