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PCB
US$0.12-0.25 / Piece
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What is Security PCB 12 Layer Impedance IC Test Board Enig 2oz China Factory

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.12-0.25 / Piece

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Blind Hole BGA, DDR
  • Application Automotive Electronics,Security,Digital Products
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Organic Resin
  • Brand Abis Circuits
  • Transport Package Vacuum Packaging
  • Specification High TG 170
  • Origin Shenzhen, China
  • Certification UL,ISO9001&ISO14001,SGS,RoHS,IATF16949
  • Copper Thickness 2oz
  • Min Line Width/Space 0.075mm
  • Surface Finish Enig
  • Solder Mask Color Green
  • Layer 12
  • Board Thickness 3mm

Product Description

Product Description ABIS PCBA Projects Introduction ABIS CIRCUITS Company deliver services, not only products. We offer solutions, not only goods. From the PCB production, the components purchasing to the components assemble. Includes: PCB Custom PCB drawing / design according to your ...

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PCB Comparison
Transaction Info
Price US$0.12-0.25 / Piece US$5.00 / Piece US$3.00-10.00 / Piece US$5.00 / Piece US$8.00 / Piece
Min Order 1 Piece 1 Piece 1 Piece 1 Piece 1 Piece
Payment Terms LC, T/T, PayPal, Western Union LC, T/T, D/P, PayPal, Western Union, Small-amount payment T/T LC, T/T, D/P, PayPal, Western Union, Small-amount payment T/T
Quality Control
Product Certification UL,ISO9001&ISO14001,SGS,RoHS,IATF16949 ISO9001/Ts16949/RoHS/Ts16949 - ISO9001/Ts16949/RoHS/Ts16949 -
Management System Certification - - ISO9001:2015 - ISO9001:2015
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America Domestic North America Domestic
Annual Export Revenue - - - - -
Business Model - ODM, OEM ODM, OEM ODM, OEM ODM, OEM
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays, one month
Off Season Lead Time: within 15 workdays, one month
Peak Season Lead Time: one month
Off Season Lead Time: one month
Peak Season Lead Time: within 15 workdays, one month
Off Season Lead Time: within 15 workdays, one month
Peak Season Lead Time: one month
Off Season Lead Time: one month
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Blind Hole BGA, DDR;
Application: Automotive Electronics,Security,Digital Products;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Abis Circuits;
Copper Thickness: 2oz;
Min Line Width/Space: 0.075mm;
Surface Finish: Enig;
Solder Mask Color: Green;
Layer: 12;
Board Thickness: 3mm;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Application: Medical Instruments;
Flame Retardant Properties: V2;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Color: Customized;
Testing Service: Aoi/ X-ray/ Fai;
Board Thickness: 1.6mm;
Number of Layers: 1-58 Layers;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Hongzhou;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Application: Medical Instruments;
Flame Retardant Properties: V2;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Mu Star;
Color: Customized;
Testing Service: Aoi/ X-ray/ Fai;
Board Thickness: 1.6mm;
Number of Layers: 1-58 Layers;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Hongzhou;
PCBA-Testing: X-ray, Aoi;
Supplier Name

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Mu Star (shenzhen) Industry Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Hongzhou Smart Technology Co., Ltd.

Diamond Member Audited Supplier

Mu Star (shenzhen) Industry Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Hongzhou Smart Technology Co., Ltd.

Diamond Member Audited Supplier

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