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LED PCB
US$0.01-100.00 / Piece
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What is Sigle/Double Sided Mc PCB Board for LED/Lamp/Lighting/Bulb

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.01-100.00 / Piece

Sepcifications

  • Type Flexible Circuit Board
  • Flame Retardant Properties V0
  • Dielectric Polyimide
  • Base Material Copper
  • Insulation Materials Epoxy Resin
  • Processing Technology Electrolytic Foil
  • Application LED
  • Mechanical Rigid Fexible
  • Material Polyimide
  • Brand Abis
  • Transport Package Vacuum Packing
  • Specification Custom
  • Trademark Abis Circuits
  • Origin Shenzhen, China
  • Certification UL,ISO9001&ISO14001,SGS,RoHS,Ts16949
  • Thermal Conductivity 0.8-3W/M.K
  • Board Thickness 0.3-5mm
  • Copper Thickness 1-6oz
  • Special Process COB(Chip on Board/Direct Touch/Wire Bonding)

Product Description

Sigle/Double Sided MC PCB Board for LED/Lamp/Lighting/Bulb with High Quality and Competitive Price Technical &Capability Item Speci. Layers 1~2 Common Finish Board Thickness 0.3-5mm Material Aluminum Base, Copper base Max Panel Size 1200mm*560mm(47in*22in) Min Hole Size ...

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LED PCB Comparison
Transaction Info
Price US$0.01-100.00 / Piece US$0.80-2.60 / Piece US$0.80-2.60 / Piece US$0.80-2.60 / Piece US$0.80-2.60 / Piece
Min Order 1 Piece 1 Piece 1 Piece 1 Piece 1 Piece
Payment Terms LC, T/T, PayPal, Western Union T/T, Western Union T/T, Western Union T/T, Western Union T/T, Western Union
Quality Control
Product Certification UL,ISO9001&ISO14001,SGS,RoHS,Ts16949 - - - -
Management System Certification - ISO14001, ISO9001:2015, ISO45001:2018, Others ISO14001, ISO9001:2015, ISO45001:2018, Others ISO14001, ISO9001:2015, ISO45001:2018, Others ISO14001, ISO9001:2015, ISO45001:2018, Others
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe Southeast Asia/ Mideast, Domestic Southeast Asia/ Mideast, Domestic Southeast Asia/ Mideast, Domestic Southeast Asia/ Mideast, Domestic
Annual Export Revenue - - - - -
Business Model - Own Brand, ODM Own Brand, ODM Own Brand, ODM Own Brand, ODM
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Flexible Circuit Board;
Flame Retardant Properties: V0;
Dielectric: Polyimide;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Processing Technology: Electrolytic Foil;
Application: LED;
Mechanical Rigid: Fexible;
Material: Polyimide;
Brand: Abis;
Thermal Conductivity: 0.8-3W/M.K;
Board Thickness: 0.3-5mm;
Copper Thickness: 1-6oz;
Special Process: COB(Chip on Board/Direct Touch/Wire Bonding);
Type: Rigid Circuit Board;
Flame Retardant Properties: Customized;
Dielectric: MCPCB\Fr4\Bt;
Base Material: Double-Sided/Multilayer Aluminum/Copper;
Insulation Materials: Customized;
Processing Technology: Delay Pressure Foil;
Application: New Energy Vehicle Electronic Control Board;
Mechanical Rigid: Rigid;
Material: Aluminum;
Brand: Hongyu;
Board Thickness: 1.6mm;
Metal Core PCB: Aluminum 5052 Core (1.4mm);
Thermal Conductivity: 2W/M·K (Dielectric Layer);
Copper Foil: 35μm;
Tg: 130°C;
Type: Rigid Circuit Board;
Flame Retardant Properties: Customized;
Dielectric: MCPCB\Fr4\Bt;
Base Material: Double-Sided/Multilayer Aluminum/Copper;
Insulation Materials: Customized;
Processing Technology: Delay Pressure Foil;
Application: New Energy Vehicle Electronic Control Board;
Mechanical Rigid: Rigid;
Material: Aluminum;
Brand: Hongyu;
Board Thickness: 1.6mm;
Metal Core PCB: Aluminum 5052 Core (1.4mm);
Thermal Conductivity: 2W/M·K (Dielectric Layer);
Copper Foil: 35μm;
Tg: 130°C;
Type: Rigid Circuit Board;
Flame Retardant Properties: Customized;
Dielectric: MCPCB\Fr4\Bt;
Base Material: Double-Sided/Multilayer Aluminum/Copper;
Insulation Materials: Customized;
Processing Technology: Delay Pressure Foil;
Application: New Energy Vehicle Electronic Control Board;
Mechanical Rigid: Rigid;
Material: Aluminum;
Brand: Hongyu;
Board Thickness: 1.6mm;
Metal Core PCB: Aluminum 5052 Core (1.4mm);
Thermal Conductivity: 2W/M·K (Dielectric Layer);
Copper Foil: 35μm;
Tg: 130°C;
Type: Combining Rigid Circuit Board;
Flame Retardant Properties: Customized;
Dielectric: MCPCB\Fr4\Bt;
Base Material: Double-Sided/Multilayer Aluminum/Copper;
Insulation Materials: Customized;
Processing Technology: Delay Pressure Foil;
Application: New Energy Vehicle Electronic Control Board;
Mechanical Rigid: Rigid;
Material: Copper-Based;
Brand: Hongyu;
Board Thickness: 1.5mm;
Metal Core PCB: T2 High Conductivity Copper(1.5mm);
Thermal Conductivity: 398W/M·K (Dielectric Layer);
Copper Foil: 70/70μm;
Tg: 150°C;
Supplier Name

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Jiangxi Hongyu Circuit Technology Co., Ltd.

Diamond Member Audited Supplier

Jiangxi Hongyu Circuit Technology Co., Ltd.

Diamond Member Audited Supplier

Jiangxi Hongyu Circuit Technology Co., Ltd.

Diamond Member Audited Supplier

Jiangxi Hongyu Circuit Technology Co., Ltd.

Diamond Member Audited Supplier

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