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Printed Circuit Board
US$0.10-20.00 / Piece
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What is 2.0W Electronics MCPCB High-Quality PCB Design / Prototype Samples Producing for LED Light PCB Board

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.10-20.00 / Piece

Sepcifications

  • Type Rigid Circuit Board
  • Flame Retardant Properties V0
  • Dielectric Al
  • Base Material Aluminum
  • Insulation Materials Epoxy Resin
  • Processing Technology Electrolytic Foil
  • Application Consumer Electronics
  • Mechanical Rigid Rigid
  • Material Aluminum
  • Brand Al
  • Transport Package Vacuum Packing
  • Specification 120*120 mm
  • Trademark Abis
  • Origin China
  • Shenzhen China

Product Description

ABIS CIRCUITS CO., LTD Briefly introduce our strengths: 1. A professional PCB manufacturer which was established on Oct, 2006 2. Focusing on double side, Multilayer and HDI pcb mass production 3. Two factories, one for small and middle volume orders, another for big volume and HDI ...

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Printed Circuit Board Comparison
Transaction Info
Price US$0.10-20.00 / Piece US$0.80-2.60 / Piece US$0.80-2.60 / Piece US$0.80-2.60 / Piece US$0.80-2.60 / Piece
Min Order 1 Piece 1 Piece 1 Piece 1 Piece 1 Piece
Payment Terms LC, T/T, PayPal, Western Union T/T, Western Union T/T, Western Union T/T, Western Union T/T, Western Union
Quality Control
Management System Certification - ISO14001, ISO9001:2015, ISO45001:2018, Others ISO14001, ISO9001:2015, ISO45001:2018, Others ISO14001, ISO9001:2015, ISO45001:2018, Others ISO14001, ISO9001:2015, ISO45001:2018, Others
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe Southeast Asia/ Mideast, Domestic Southeast Asia/ Mideast, Domestic Southeast Asia/ Mideast, Domestic Southeast Asia/ Mideast, Domestic
Annual Export Revenue - - - - -
Business Model - Own Brand, ODM Own Brand, ODM Own Brand, ODM Own Brand, ODM
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: Al;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Processing Technology: Electrolytic Foil;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Material: Aluminum;
Brand: Al;
Shenzhen: China;
Type: Combining Rigid Circuit Board;
Flame Retardant Properties: Customized;
Dielectric: MCPCB\Fr4\Bt;
Base Material: Double-Sided/Multilayer Aluminum/Copper;
Insulation Materials: Customized;
Processing Technology: Delay Pressure Foil;
Application: New Energy Vehicle Electronic Control Board;
Mechanical Rigid: Rigid;
Material: Aluminum;
Brand: Hongyu;
Board Thickness: 1.6mm;
Metal Core PCB: Aluminum 1060 Core (1.4mm);
Thermal Conductivity: 3W/M·K (Dielectric Layer);
Copper Foil: 35μm;
Tg: 130°c;
Type: Rigid Circuit Board;
Flame Retardant Properties: Customized;
Dielectric: MCPCB\Fr4\Bt;
Base Material: Double-Sided/Multilayer Aluminum/Copper;
Insulation Materials: Customized;
Processing Technology: Delay Pressure Foil;
Application: New Energy Vehicle Electronic Control Board;
Mechanical Rigid: Rigid;
Material: Aluminum;
Brand: Hongyu;
Board Thickness: 1.6mm;
Metal Core PCB: Aluminum 5052 Core (1.4mm);
Thermal Conductivity: 2W/M·K (Dielectric Layer);
Copper Foil: 35μm;
Tg: 130°C;
Type: Rigid Circuit Board;
Flame Retardant Properties: Customized;
Dielectric: MCPCB\Fr4\Bt;
Base Material: Double-Sided/Multilayer Aluminum/Copper;
Insulation Materials: Customized;
Processing Technology: Delay Pressure Foil;
Application: New Energy Vehicle Electronic Control Board;
Mechanical Rigid: Rigid;
Material: Aluminum;
Brand: Hongyu;
Board Thickness: 1.6mm;
Metal Core PCB: Aluminum 5052 Core (1.4mm);
Thermal Conductivity: 2W/M·K (Dielectric Layer);
Copper Foil: 35μm;
Tg: 130°C;
Type: Rigid Circuit Board;
Flame Retardant Properties: Customized;
Dielectric: MCPCB\Fr4\Bt;
Base Material: Double-Sided/Multilayer Aluminum/Copper;
Insulation Materials: Customized;
Processing Technology: Delay Pressure Foil;
Application: New Energy Vehicle Electronic Control Board;
Mechanical Rigid: Rigid;
Material: Aluminum;
Brand: Hongyu;
Board Thickness: 1.6mm;
Metal Core PCB: Aluminum 5052 Core (1.4mm);
Thermal Conductivity: 2W/M·K (Dielectric Layer);
Copper Foil: 35μm;
Tg: 130°C;
Supplier Name

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Jiangxi Hongyu Circuit Technology Co., Ltd.

Diamond Member Audited Supplier

Jiangxi Hongyu Circuit Technology Co., Ltd.

Diamond Member Audited Supplier

Jiangxi Hongyu Circuit Technology Co., Ltd.

Diamond Member Audited Supplier

Jiangxi Hongyu Circuit Technology Co., Ltd.

Diamond Member Audited Supplier

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