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PCB Board
US$0.01-100.00 / Piece
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What is Customized LED Panel Board Light PCB Board LED Single Side Aluminum PCB Board

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.01-100.00 / Piece

Sepcifications

  • Type Rigid Circuit Board
  • Flame Retardant Properties V1
  • Dielectric Aluminum
  • Base Material Copper
  • Insulation Materials Organic Resin
  • Processing Technology Electrolytic Foil
  • Application Consumer Electronics
  • Mechanical Rigid Fexible
  • Material Aluminum
  • Brand Abis
  • Transport Package Vacuum Packing
  • Specification 40mm*40mm
  • Trademark Abis
  • Origin China
  • Insulation Layer Thickness 0.075mm--5.00mm
  • Board Outline Tolerance +0.10mm
  • Mini. Solder Mask Clearance 0.05mm
  • Surface Finishing HASL,Enig,Chem,Tin,Flash Gold, OSP, Gold Finger

Product Description

Customized LED Panel Board Light PCB Board LED Single Side Aluminum PCB Board Technical &Capability Item Speci. Layers 1~2 Common Finish Board Thickness 0.3-5mm Material Aluminum Base, Copper base Max Panel Size 1200mm*560mm(47in*22in) Min Hole Size 12mil(0.3mm) Min Line ...

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PCB Board Comparison
Transaction Info
Price US$0.01-100.00 / Piece US$0.80-2.60 / Piece US$0.80-2.60 / Piece US$0.80-2.60 / Piece US$0.80-2.60 / Piece
Min Order 1 Piece 1 Piece 1 Piece 1 Piece 1 Piece
Payment Terms LC, T/T, PayPal, Western Union T/T, Western Union T/T, Western Union T/T, Western Union T/T, Western Union
Quality Control
Management System Certification - ISO14001, ISO9001:2015, ISO45001:2018, Others ISO14001, ISO9001:2015, ISO45001:2018, Others ISO14001, ISO9001:2015, ISO45001:2018, Others ISO14001, ISO9001:2015, ISO45001:2018, Others
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe Southeast Asia/ Mideast, Domestic Southeast Asia/ Mideast, Domestic Southeast Asia/ Mideast, Domestic Southeast Asia/ Mideast, Domestic
Annual Export Revenue - - - - -
Business Model - Own Brand, ODM Own Brand, ODM Own Brand, ODM Own Brand, ODM
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Rigid Circuit Board;
Flame Retardant Properties: V1;
Dielectric: Aluminum;
Base Material: Copper;
Insulation Materials: Organic Resin;
Processing Technology: Electrolytic Foil;
Application: Consumer Electronics;
Mechanical Rigid: Fexible;
Material: Aluminum;
Brand: Abis;
Insulation Layer Thickness: 0.075mm--5.00mm;
Board Outline Tolerance: +0.10mm;
Mini. Solder Mask Clearance: 0.05mm;
Surface Finishing: HASL,Enig,Chem,Tin,Flash Gold, OSP, Gold Finger;
Type: Combining Rigid Circuit Board;
Flame Retardant Properties: Customized;
Dielectric: MCPCB\Fr4\Bt;
Base Material: Double-Sided/Multilayer Aluminum/Copper;
Insulation Materials: Customized;
Processing Technology: Delay Pressure Foil;
Application: New Energy Vehicle Electronic Control Board;
Mechanical Rigid: Rigid;
Material: Copper-Based;
Brand: Hongyu;
Board Thickness: 2.0mm;
Metal Core PCB: Oxygen-Free Copper(OFC) 2.0mm;
Thermal Conductivity: 398W/M·K (Dielectric Layer);
Copper Foil: 70μm;
Tg: 150°C;
Type: Combining Rigid Circuit Board;
Flame Retardant Properties: Customized;
Dielectric: MCPCB\Fr4\Bt;
Base Material: Double-Sided/Multilayer Aluminum/Copper;
Insulation Materials: Customized;
Processing Technology: Delay Pressure Foil;
Application: New Energy Vehicle Electronic Control Board;
Mechanical Rigid: Rigid;
Material: Copper-Based;
Brand: Hongyu;
Board Thickness: 2.0mm;
Metal Core PCB: Oxygen-Free Copper(OFC) 2.0mm;
Thermal Conductivity: 398W/M·K (Dielectric Layer);
Copper Foil: 70μm;
Tg: 150°C;
Type: Combining Rigid Circuit Board;
Flame Retardant Properties: Customized;
Dielectric: MCPCB\Fr4\Bt;
Base Material: Double-Sided/Multilayer Aluminum/Copper;
Insulation Materials: Customized;
Processing Technology: Delay Pressure Foil;
Application: New Energy Vehicle Electronic Control Board;
Mechanical Rigid: Rigid;
Material: Copper-Based;
Brand: Hongyu;
Board Thickness: 2.0mm;
Metal Core PCB: Oxygen-Free Copper(OFC) 2.0mm;
Thermal Conductivity: 398W/M·K (Dielectric Layer);
Copper Foil: 70μm;
Tg: 150°C;
Type: Combining Rigid Circuit Board;
Flame Retardant Properties: Customized;
Dielectric: MCPCB\Fr4\Bt;
Base Material: Double-Sided/Multilayer Aluminum/Copper;
Insulation Materials: Customized;
Processing Technology: Delay Pressure Foil;
Application: New Energy Vehicle Electronic Control Board;
Mechanical Rigid: Rigid;
Material: Copper-Based;
Brand: Hongyu;
Board Thickness: 2.0mm;
Metal Core PCB: Oxygen-Free Copper(OFC) 2.0mm;
Thermal Conductivity: 398W/M·K (Dielectric Layer);
Copper Foil: 70μm;
Tg: 150°C;
Supplier Name

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Jiangxi Hongyu Circuit Technology Co., Ltd.

Diamond Member Audited Supplier

Jiangxi Hongyu Circuit Technology Co., Ltd.

Diamond Member Audited Supplier

Jiangxi Hongyu Circuit Technology Co., Ltd.

Diamond Member Audited Supplier

Jiangxi Hongyu Circuit Technology Co., Ltd.

Diamond Member Audited Supplier

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