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Quick Rigid Double Layers Fr4 Circuit Board High Tg Immersion Gold/Tin/OSP Surface Video

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.10-10.00 / Piece

Sepcifications

  • Structure Double-Sided Rigid PCB
  • Dielectric FR-4
  • Application Communication
  • Flame Retardant Properties V0
  • Processing Technology Electrolytic Foil
  • Base Material Fr4
  • Insulation Materials Epoxy Resin
  • Brand Abis
  • Transport Package Vacuum Packing
  • Specification 120*130mm
  • Trademark ABIS CIRCUITS
  • Origin Shenzhen, China
  • Copper Thickness 1 Oz
  • Board Layer 2 Layers
  • Board Thickness 1.6mm
  • Surface Finish Gold Plating,Enig
  • Solder Mask Green
  • Legend White

Product Description

Quick Rigid Double Layers FR4 Circuit Board High Tg Immersion Gold/Tin/OSP Surface Product Detail Item Spec Layers 1~20 Board Thickness 0.1mm-8.0mm Material FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base, etc Max Panel Size 600mm×1200mm Min Hole Size ...

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PCB Comparison
Transaction Info
Price US$0.10-10.00 / Piece US$0.90-99.99 / PCS US$0.90-99.99 / PCS US$0.90-99.99 / PCS US$0.90-99.99 / PCS
Min Order 1 Piece 1 PCS 1 PCS 1 PCS 1 PCS
Payment Terms LC, T/T, PayPal, Western Union Small-amount payment, Western Union, PayPal, D/P, T/T, LC Small-amount payment, Western Union, PayPal, D/P, T/T, LC Small-amount payment, Western Union, PayPal, D/P, T/T, LC Small-amount payment, Western Union, PayPal, D/P, T/T, LC
Quality Control
Management System Certification - - - - -
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia
Annual Export Revenue - - - - -
Business Model - ODM, OEM ODM, OEM ODM, OEM ODM, OEM
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays, one month
Off Season Lead Time: within 15 workdays, one month		 Peak Season Lead Time: within 15 workdays, one month
Off Season Lead Time: within 15 workdays, one month		 Peak Season Lead Time: within 15 workdays, one month
Off Season Lead Time: within 15 workdays, one month		 Peak Season Lead Time: within 15 workdays, one month
Off Season Lead Time: within 15 workdays, one month
Product Attributes
Specification
Structure: Double-Sided Rigid PCB;
Dielectric: FR-4;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Copper Thickness: 1 Oz;
Board Layer: 2 Layers;
Board Thickness: 1.6mm;
Surface Finish: Gold Plating,Enig;
Solder Mask: Green;
Legend: White;
Structure: Double-Sided Rigid PCB;
Dielectric: Ad255c;
Material: Glass-Reinforced, PTFE Based Composites;
Application: Antennas;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Rogers;
Surface Finish: Immersion Gold;
Laminate Thickness: 60mil;
Layer Count: Double Sided PCB;
Final Foil External: 1.0 Oz;
Structure: Multilayer Rigid PCB;
Dielectric: Tc600;
Material: Ceramic Filled PTFE/Woven Fiberglass;
Application: Antennas;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Rogers;
Surface Finish: Bare Copper, HASL, Enig, Immersion Silver, etc.;
Laminate Thickness: 15mil 20mil 30mil 50mil 60mil;
Layer Count: Double Sided PCB, Multilayer PCB, Hybrid PCB;
Solder Mask: Green, Black, Blue, Yellow, Red etc.;
Structure: Multilayer Rigid PCB;
Dielectric: RO4003c;
Material: RO4003c with High Tg Fr-4;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Rogers;
Surface Finish: Enig;
Board Thickness: 1.10mm (Finished);
Layer Count: 6-Layer;
Copper Weight: 1 Oz (35μm) All Layers;
Structure: Multilayer Rigid PCB;
Dielectric: RO4835;
Material: RO4835 + High Tg Fr-4;
Application: RF and Microwave;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Rogers;
Surface Finish: Enig;
Board Thickness: 1.20mm (Finished);
Layer Count: 6-Layer;
Copper Weight: 1 Oz (35μm) All Layers;
Supplier Name

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Bicheng Electronic Technology Co., Ltd

Gold Member Audited Supplier

Shenzhen Bicheng Electronic Technology Co., Ltd

Gold Member Audited Supplier

Shenzhen Bicheng Electronic Technology Co., Ltd

Gold Member Audited Supplier

Shenzhen Bicheng Electronic Technology Co., Ltd

Gold Member Audited Supplier

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