| Specification |
Insulation Materials: Epoxy Resin;
Flame Retardant Properties: V0;
Application: Consumer Electronics;
Layer: 1-2 Layers;
Common Finish Board Thickness: 0.3-5mm;
Raw Material: Aluminum Base, Copper Base;
Min Line Width/Space: 3mil(0.075mm);
Impedance Control Tolerance: +/-10%;
Solder Mask/Silkscreen: Custom;
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Insulation Materials: Epoxy Resin;
Flame Retardant Properties: V0;
Application: Medical Instruments;
Board Material: Polyimide;
Board Layer: 2;
Board Thickness: 0.1 mm;
Copper Thickness: 1 Oz;
Solser Mask: Green;
Silkscreen: White;
Surface Finishing: Enig;
Lead Time: 4-5 Working Days;
Shipping Type: DHL.TNT, EMS, FedEx, UPS etc;
Structure: Double-Sided FPC;
Combination Mode: Adhesive Flexible Plate;
Conductive Adhesive: Conductive Silver Paste;
Processing Technology: Electrolytic Foil;
Material: Fr4+Polyimide;
Base Material: Fr4+Polyimide;
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Flame Retardant Properties: V0;
Board Material: Fr4 and Polyimide;
Board Layer: 2 Layer Rigide and 2 Layer Flex;
Copper Thickness: 2 Oz;
Min. Line Space: 0.1mm;
Min.Hole Size: 0.15mm;
Solder Mask: Any Color;
Silkscreen: Any Color;
Surface Finishing: Gold Plate;
Lead Time: 5-6 Working Days;
Shipping Type: DHL, UPS, TNT, EMS, FedEx etc;
Dielectric: Fr4 and Polyimide;
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Insulation Materials: Epoxy Resin;
Flame Retardant Properties: V0, HB;
Application: Medical Instruments, Communication;
Type: Rigid Circuit Board;
Dielectric: Fr-4;
Material: Fiberglass Epoxy;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Board Thickness: 1.6mm;
Board Layer: 4 Layers;
Copper Thickness: 1 Oz;
Solder Mask: Green;
Silksreen: White;
Surface Finihsing: HASL-Lf;
Lead Time: 6-8 Working Days;
Min. Hole Size: 0.20 mm;
Min Line Width&Space: 0.15 mm;
Test: Fly Probe Tseting;
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Insulation Materials: Epoxy Resin;
Flame Retardant Properties: HB;
Application: Communication;
Type: Rigid Circuit Board;
Dielectric: Fr-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V2;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Insulation Materials: Organic Resin;
Base Material: Fr4;
Brand: Fastline;
Board Thickness: 1.6mm;
Copper Thickness: 1oz;
Material Type: Fr4;
Surface Treatment: HASL Lead Free;
Solder Mask: Green, Red, Blue, Black;
Silk Screen Color: White;
Board Layer: 1 Layer;
Shipping Type: DHL, UPS, TNT, EMS, FedEx etc;
Packing Type: Carton + Vacuum;
Lead Time: 5-7 Days;
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