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Multi Layer PCB Circuit Manufacturing

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.10-80.00 / Piece

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Consumer Electronics
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Kb
  • Insulation Materials Epoxy Resin
  • Brand Abis
  • Transport Package Vacuum Packing
  • Specification Custom
  • Trademark Abis Circuits
  • Origin Shenzhen, China
  • Certification UL,ISO9001&ISO14001,SGS,RoHS Report
  • Holes Specification Buried/Blind Vias, Via in Pads, Counter Sink Hole
  • Board Thickness 0.2-6mm
  • Copper Thickness 0.5-8oz
  • Layers 1-20layers

Product Description

Multi Layer PCB Circuit Manufacturing ABIS CIRCUITS CO., LTD is a professional PCB manufacturing which is focus on double side, Multilayer and HDI pcb mass production. The company was established on 2006, We have two factories together(audited by UL,ISO9001/14001,SGS,RoHS report) ,And all ...

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Circuit Manufacturing Comparison
Transaction Info
Price US$0.10-80.00 / Piece US$1.00 / Piece US$0.40 / Piece US$70.00 / Piece US$5.00 / Piece
Min Order 1 Piece 1 Piece 1 Piece 1 Piece 1 Piece
Payment Terms LC, T/T, PayPal, Western Union T/T, PayPal, Western Union T/T, PayPal, Western Union T/T, PayPal, Western Union T/T, PayPal, Western Union
Quality Control
Product Certification UL,ISO9001&ISO14001,SGS,RoHS Report - - - -
Management System Certification - - - - -
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model - - - - -
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Kb;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole;
Board Thickness: 0.2-6mm;
Copper Thickness: 0.5-8oz;
Layers: 1-20layers;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Mulitilay Layer PCB: 220mm*150mm;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Medical Instruments;
Flame Retardant Properties: V2;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Telfon PCB: 260mm*150mm;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V2;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Supplier Name

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

R-CREATION Technology Co., Ltd.

Gold Member Audited Supplier

R-CREATION Technology Co., Ltd.

Gold Member Audited Supplier

R-CREATION Technology Co., Ltd.

Gold Member Audited Supplier

R-CREATION Technology Co., Ltd.

Gold Member Audited Supplier

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