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10 Layer Circuit Board Immersion Gold PCB for Industrial Control Board Video

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.01-50.00 / Piece

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Application Computer
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Iteq
  • Insulation Materials Epoxy Resin
  • Brand Abis
  • Transport Package Vacuum Package
  • Specification UL, ISO14001, ISO9001, SGS
  • Trademark ABIS CIRCUITS
  • Origin Made in China
  • Layer 1-50
  • Thickness 0.1-6.0mm
  • Copper 1oz-6ozmm
  • Surface Hal-Lf, Gold, Silver

Product Description

10 Layer Circuits Board Immersion Gold PCB for Industrial Control Board 1. Single, Double side &Multi-layer PCB. 2. Buried/Blind Vias, Via in Pad, Counter Sink Hole, Screw Hole(Counterbore), Press-fit, Half Hole. 3. HASL lead-free, Immersion Gold/ Silver/Tin, OSP, Gold plating/finger, Peelable ...

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PCBA Comparison
Transaction Info
Price US$0.01-50.00 / Piece US$0.74-1.33 / PCS US$1.35-2.16 / Piece US$0.70-5.00 / Piece US$1.28-1.76 / Piece
Min Order 1 Piece 1 PCS 1 Piece 10 Pieces 1 Piece
Payment Terms LC, T/T, PayPal, Western Union LC, T/T, D/P, PayPal, Western Union LC, T/T, D/P, PayPal, Western Union T/T LC, T/T, D/P, PayPal, Western Union
Quality Control
Product Certification - ISO,UL,RoHS - RoHS, CCC, ISO -
Management System Certification - - - ISO9001:2015 -
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe Domestic North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe
Annual Export Revenue - - - - -
Business Model - - - ODM, OEM -
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: one month
Off Season Lead Time: one month		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Application: Computer;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Iteq;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Layer: 1-50;
Thickness: 0.1-6.0mm;
Copper: 1oz-6ozmm;
Surface: Hal-Lf, Gold, Silver;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Immersional Gold;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Ucreate PCB;
Board Thickness: 1.2~2.0mm;
Surface Finihsing: Immersional Gold;
Lead Time: 6-8 Working Days;
PCB Testing: E-Testing; Flying Probe Testing;
Mask Ink Color: White/Black/Green/Red/Yellow/Blue;
Color: Green Blue Red;
Number of Layers: Multilayer;
Copper Thickness: 2oz;
Condition: Original Made;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Computer;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: UC;
Layer: 8;
Via: 1+6+1;
Copper: 1/3 Oz;
Surface: Enig;
Type: Customized;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Customized;
Processing Technology: Customized;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: OEM/ODM;
PCBA-Testing: X-ray, Aoi;
Processing: Electrolytic Foil;
SMT Capacity: >2 Million Points/Day;
DIP Capacity: >100K Parts/Day;
Min. Space of BGA: +/- 0.3mm;
Min.Pin Space of IC: 0.3mm;
Max.Precision of IC Assembly: 0.03mm;
Surface Finishing: Lead-Free HASL;
Number of Layers: 4-10 Layer;
Board Thickness: 1.6mm;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: UC;
Board Layer: 6;
Board Thickness: 1.6mm;
Soldermask Color: Green;
Surface Finish: Enig/3u'';
Specialities: BGA;
Base Material Type: Fr4;
Ipc Standards: Ipc Class II;
PCB Testing: E-Testing, Flying Probe Testing;
Lead Time: 8 Working Days;
Fast Turn: 3 Working Days;
Supplier Name

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Hongzhou Smart Technology Co., Ltd.

Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

Diamond Member Audited Supplier

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