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6 Layer FPC Immersion Gold Flex Circuit Board Multilayer Flexible PCB Video

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.01-150.00 / Piece

Sepcifications

  • Structure Single-Sided FPC
  • Material Polyimide
  • Combination Mode Adhesive Flexible Plate
  • Application Computer with LCD Screen
  • Conductive Adhesive Conductive Silver Paste
  • Flame Retardant Properties V0
  • Processing Technology Electrolytic Foil
  • Insulation Materials Organic Resin
  • Brand N/a
  • Transport Package Vacuum Packaging
  • Specification ISO9001& ISO14001& SGS& UL
  • Trademark ABIS CIRCUITS CO., LTD
  • Origin Made in China
  • Thickness 0.10mm
  • Cu 35um/35um
  • Surface Enig
  • Solder Mask Yellow
  • Stiffener No

Product Description

6 Layer FPC Immersion Gold Flex Circuit Board Multilayer Flexible PCB 1. Single, Double side &Multi-layer PCB. 2. Buried/Blind Vias, Via in Pad, Counter Sink Hole, Screw Hole(Counterbore), Press-fit, Half Hole. 3. HASL lead-free, Immersion Gold/ Silver/Tin, OSP, Gold plating/finger, Peelable ...

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Flexible PCB Board Comparison
Transaction Info
Price US$0.01-150.00 / Piece US$0.20-5.00 / Piece US$0.04 / Piece US$0.10 / Piece US$0.10-5.00 / Piece
Min Order 1 Piece 1 Piece 100 Pieces 1,000 Pieces 1 Piece
Payment Terms LC, T/T, PayPal, Western Union T/T, D/P, LC, PayPal, Western Union, Small-amount payment T/T T/T, PayPal, Western Union -
Quality Control
Management System Certification - ISO9001:2015, ISO45001:2018, ISO14001, Others - - -
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, Europe, Southeast Asia/ Mideast North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Western Europe
Annual Export Revenue - - - - -
Business Model - ODM, OEM - - -
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: 3-6 months
Off Season Lead Time: 3-6 months
Product Attributes
Specification
Structure: Single-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Computer with LCD Screen;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Insulation Materials: Organic Resin;
Brand: N/a;
Thickness: 0.10mm;
Cu: 35um/35um;
Surface: Enig;
Solder Mask: Yellow;
Stiffener: No;
Structure: Single-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace, Industrial Controls;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Insulation Materials: Organic Resin;
Brand: Shanyo;
Sample: Free;
Switch Stroke: Flat Type 0.1-0.5mm;
Color: Clear Metal Color;
Dimension/Shape: OEM Service;
Keypad Button Material: Metal;
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Xtz;
Structure: Double-Sided FPC;
Material: Polyester Film;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Eshine;
Structure: Multilayer FPC;
Material: Polyimide;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: PS;
Quality Test: Aoi, 100% E-Test;
V- Cut Tolerance: +-10mi;
Bevel Edge: +-5mil;
Hole Location Tolerance: +-2mil;
Hole Diameter Tolerance: +-0.05mm;
Board Thickness Tolerance: +-5%;
Line Width/Space Tolerance: +-10%;
Supplier Name

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Qingdao Shanyo Precision Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

SHENZHEN XIANGTIANZHONG TECHNOLOGY CO., LTD.

Gold Member Audited Supplier

ESHINE CORP LIMITED

Gold Member

Ps Electronics Co., Ltd

Diamond Member Audited Supplier

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