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Printed Circuit Board
US$0.0001-99.00 / Piece
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What is Printed Circuit Pattern Plating Printed Board Assembly Backplane PCBA Board PCB

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.0001-99.00 / Piece

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Communication
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Epoxy Resin
  • Brand Abis
  • Transport Package Vacuum Packing
  • Specification 1 Pieces/Panel
  • Trademark Abis
  • Origin Shenzhen, China
  • Layers 16 Layers
  • Solder Mask Green
  • Legend Write
  • Surface Finish Hard Gold 3u
  • Thickness 4.7mm
  • Outer Copper Thcikness 2oz

Product Description

Manufacturer Fabrication Rogers PCBA Assembly Factory Medical Green Enig 6 Layers PCB Circuit 1. Single, Double side &Multi-layer PCB. 2. Buried/Blind Vias, Via in Pad, Counter Sink Hole, Screw Hole(Counterbore), Press-fit, Half Hole. 3. HASL lead-free, Immersion Gold/ Silver/Tin, OSP, Gold ...

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Printed Circuit Board Comparison
Transaction Info
Price US$0.0001-99.00 / Piece US$0.80-2.60 / Piece US$0.80-2.60 / Piece US$0.80-2.60 / Piece US$0.80-2.60 / Piece
Min Order 1 Piece 1 Piece 1 Piece 1 Piece 1 Piece
Payment Terms LC, T/T, PayPal, Western Union T/T, Western Union T/T, Western Union T/T, Western Union T/T, Western Union
Quality Control
Management System Certification - ISO14001, ISO9001:2015, ISO45001:2018, Others ISO14001, ISO9001:2015, ISO45001:2018, Others ISO14001, ISO9001:2015, ISO45001:2018, Others ISO14001, ISO9001:2015, ISO45001:2018, Others
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe Southeast Asia/ Mideast, Domestic Southeast Asia/ Mideast, Domestic Southeast Asia/ Mideast, Domestic Southeast Asia/ Mideast, Domestic
Annual Export Revenue - - - - -
Business Model - Own Brand, ODM Own Brand, ODM Own Brand, ODM Own Brand, ODM
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Layers: 16 Layers;
Solder Mask: Green;
Legend: Write;
Surface Finish: Hard Gold 3u;
Thickness: 4.7mm;
Outer Copper Thcikness: 2oz;
Type: Combining Rigid Circuit Board;
Dielectric: MCPCB\Fr4\Bt;
Application: New Energy Vehicle Electronic Control Board;
Flame Retardant Properties: Customized;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Double-Sided/Multilayer Aluminum/Copper;
Insulation Materials: Customized;
Brand: Hongyu;
Board Thickness: 1.6mm;
Metal Core PCB: T2 High Conductivity Copper(1.6mm);
Thermal Conductivity: 398W/M-K+Non Thermoelectric Separation Ar;
Copper Foil: 70μm;
Tg: 150°C;
Type: Combining Rigid Circuit Board;
Dielectric: MCPCB\Fr4\Bt;
Application: New Energy Vehicle Electronic Control Board;
Flame Retardant Properties: Customized;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Double-Sided/Multilayer Aluminum/Copper;
Insulation Materials: Customized;
Brand: Hongyu;
Board Thickness: 1.6mm;
Metal Core PCB: T2 High Conductivity Copper(1.6mm);
Thermal Conductivity: 398W/M-K+Non Thermoelectric Separation Ar;
Copper Foil: 70μm;
Tg: 150°C;
Type: Combining Rigid Circuit Board;
Dielectric: MCPCB\Fr4\Bt;
Application: New Energy Vehicle Electronic Control Board;
Flame Retardant Properties: Customized;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Double-Sided/Multilayer Aluminum/Copper;
Insulation Materials: Customized;
Brand: Hongyu;
Board Thickness: 1.6mm;
Metal Core PCB: T2 High Conductivity Copper(1.6mm);
Thermal Conductivity: 398W/M-K+Non Thermoelectric Separation Ar;
Copper Foil: 70μm;
Tg: 150°C;
Type: Combining Rigid Circuit Board;
Dielectric: MCPCB\Fr4\Bt;
Application: New Energy Vehicle Electronic Control Board;
Flame Retardant Properties: Customized;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Double-Sided/Multilayer Aluminum/Copper;
Insulation Materials: Customized;
Brand: Hongyu;
Board Thickness: 1.6mm;
Metal Core PCB: T2 High Conductivity Copper(1.6mm);
Thermal Conductivity: 398W/M-K+Non Thermoelectric Separation Ar;
Copper Foil: 70μm;
Tg: 150°C;
Supplier Name

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Jiangxi Hongyu Circuit Technology Co., Ltd.

Diamond Member Audited Supplier

Jiangxi Hongyu Circuit Technology Co., Ltd.

Diamond Member Audited Supplier

Jiangxi Hongyu Circuit Technology Co., Ltd.

Diamond Member Audited Supplier

Jiangxi Hongyu Circuit Technology Co., Ltd.

Diamond Member Audited Supplier

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