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Shenzhen Abis High Quality FPC Double-Sided Multilayers Flex PCB Printed Circuit Board with UL

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$1.00-200.00 / Piece

Sepcifications

  • Structure Multilayer FPC
  • Material Polyimide
  • Combination Mode Adhesive Flexible Plate
  • Conductive Adhesive Conductive Silver Paste
  • Processing Technology Electrolytic Foil
  • Base Material Kb
  • Brand Abis Circuits
  • Transport Package Vacuum Packing
  • Specification Custom
  • Trademark Abis Circuits
  • Origin Shenzhen, China
  • Enig Thickness 1-3u′′
  • Hard Gold Thickness 5-50u′′

Product Description

ABIS: One-Stope Service from PCB fabricate to PCB assembly Company profile Why Chose us High-end euipment-high speed Pick and Place Machines that can process about 25,000 SMD components per hour High efficient supply ability 60K Sqm monthly-Offers low volume and on-demand PCB ...

Learn More

Fr4 Comparison
Transaction Info
Price US$1.00-200.00 / Piece US$1.00-10.00 / Piece US$1.00-10.00 / Piece US$1.00-10.00 / Piece US$1.00-10.00 / Piece
Min Order 1 Piece 1 Piece 1 Piece 1 Piece 1 Piece
Payment Terms LC, T/T, PayPal, Western Union T/T, PayPal, Western Union, Small-amount payment, VTB T/T, PayPal, Western Union, Small-amount payment, VTB T/T, PayPal, Western Union, Small-amount payment, VTB T/T, PayPal, Western Union, Small-amount payment, VTB
Quality Control
Product Certification - ISO9001, ISO14001, IATF 16949, Ipc-a-610g, RoHS ISO9001, ISO14001, IATF 16949, Ipc-a-610g, RoHS ISO9001, ISO14001, IATF 16949, Ipc-a-610g, RoHS ISO9001, ISO14001, IATF 16949, Ipc-a-610g, RoHS
Management System Certification - - - - -
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Western Europe North America, South America, Western Europe North America, South America, Western Europe North America, South America, Western Europe
Annual Export Revenue - - - - -
Business Model - - - - -
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Conductive Adhesive: Conductive Silver Paste;
Processing Technology: Electrolytic Foil;
Base Material: Kb;
Brand: Abis Circuits;
Enig Thickness: 1-3u′′;
Hard Gold Thickness: 5-50u′′;
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Exceeding Electronics;
Board Thickness: 0.2-8.0mm;
PCB Material: Fr-4, Cem-1, Hight Tg, Fr4 Halogen Free, Rogers;
PCB Shape: Rectangular, Round, Slots, Cutouts, Complex;
Surface Finish: Immersion Ni/Au;
Lead Time: 6-8 Working Days;
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Exceeding Electronics;
Board Thickness: 0.2-8.0mm;
PCB Material: Fr-4, Cem-1, Hight Tg, Fr4 Halogen Free, Rogers;
PCB Shape: Rectangular, Round, Slots, Cutouts, Complex;
Surface Finish: Immersion Ni/Au;
Lead Time: 6-8 Working Days;
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Exceeding Electronics;
Board Thickness: 0.2-8.0mm;
PCB Material: Fr-4, Cem-1, Hight Tg, Fr4 Halogen Free, Rogers;
PCB Shape: Rectangular, Round, Slots, Cutouts, Complex;
Surface Finish: Immersion Ni/Au;
Lead Time: 6-8 Working Days;
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Exceeding Electronics;
Board Thickness: 0.2-8.0mm;
PCB Material: Fr-4, Cem-1, Hight Tg, Fr4 Halogen Free, Rogers;
PCB Shape: Rectangular, Round, Slots, Cutouts, Complex;
Surface Finish: Immersion Ni/Au;
Lead Time: 6-8 Working Days;
Supplier Name

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

EXCEEDING ELECTRONICS GROUP LIMITED

Diamond Member Audited Supplier

EXCEEDING ELECTRONICS GROUP LIMITED

Diamond Member Audited Supplier

EXCEEDING ELECTRONICS GROUP LIMITED

Diamond Member Audited Supplier

EXCEEDING ELECTRONICS GROUP LIMITED

Diamond Member Audited Supplier

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