| Specification |
Structure: Single-Sided FPC;
Material: Copper;
Combination Mode: Without Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace, Industrial Control;
Flame Retardant Properties: V0;
Processing Technology: Des;
Base Material: Polyimide;
Insulation Materials: Polyimide;
Brand: Flex Plus;
Copper Thickness: 1/3 Oz ~2 Oz;
Length: Max. 4mm (XL Exposure Machine);
Line Width: Min 0.05mm;
Color: White/Yellow;
Sample Delivery: 3~5days;
MP Delivery: 7~10days;
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Structure: Double-Sided FPC;
Material: Polyester Film;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V2;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Tkm;
Rated Current: 25-100mA, 0~30V DC;
Life Time: >1 Million Times;
Quality: Top Quality;
Environmental Friendly: Raw Material Pass RoHS, SGS Test;
Touch Feeling: Excellent Touch Feeling;
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Structure: Single-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Automatic Machine;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Board Size: Customized;
Board Color: Green/Black/Red/Yellow Customized;
Silkscreen Color: Green/Black/Red/Yellow Customized;
Design Improvement: Available;
Min. Line Space: 0.1mm;
Min.Hole Size: 0.15mm;
Min.Line Width: 0.1mm;
Max.Panel Size: 1200*750mm;
Certificates: ISO, UL, SGS, RoHS;
Shipping Express: DHL, UPS, TNT, Aramex, FedEx;
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Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Computer with LCD Screen;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Board Thickness: 1.6mm;
Copper Thickness: 1oz;
Shipping: DHL, UPS, TNT, FedEx, etc;
Certificates: UL, RoHS, SGS, ISO9001;
Min. Hole Size: 0.25mm;
Min. Line Width: 0.15mm;
Min. Line Spacing: 0.15mm;
Surface Treatment: HASL;
Soldermask: Green;
Silkscreen: White;
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Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Surface Finishing: Enig;
Copper Thickness: 1oz;
Min. Hole Size: 0.2mm;
Min. Line Wigth: 0.075mm;
Min. Line Spacing: 0.075mm;
Solder Mask Type: White;
Silkscreen: White;
Certificates: UL, RoHS, SGS, ISO9001;
Shipping: DHL, UPS, TNT, FedEx, etc;
Board Thickness: 0.2mm;
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