| Specification |
Structure: Multilayer FPC;
Material: Copper;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Flame Retardant Properties: V0;
Processing Technology: Des;
Base Material: Polyimide;
Insulation Materials: Polyimide;
Brand: Flex Plus;
Copper Thickness: 1/3 Oz ~2 Oz;
Length: Max. 4m (XL Exposure Machine);
Line Width: Min 0.05mm;
Color: Yellow, Green;
Sample Delivery: 3~5days;
MP Delivery: 7~10days;
Soler Mask Allignment Tolerance: 4mil;
Silkscreen Alignment Tolerance: 6mil;
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Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Anisotropic Conductive Adhesive;
Flame Retardant Properties: V2;
Processing Technology: Electrolytic Foil;
Base Material: Polyimide & Fr4;
Insulation Materials: Epoxy Resin;
Brand: Fastline;
Layer: 2;
Solder Mask: Green + Yellow Cover Film;
Board Thickess: 1.6mm Rigid and 0.1mm Flex;
Copper Thickness: 1oz;
Silk Screen: White;
Test: 100%;
Small Order: Accepter;
Board Material: Fr4+ Polymide;
PCB Type: Rigd-Flex PCB;
Product Type: Customized;
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Structure: Single-Sided FPC;
Material: Fr4 + Polymide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Fr4 + Polymide;
Insulation Materials: Epoxy Resin;
Brand: Fastline;
Board Material: Fr4 + Polymide;
Board Thickness: 1.6mm Rigid and 0.1mm Flex;
Copper Thickness: 0.5oz;
Min. Hole Size: 0.25mm;
Min. Line Width: 0.15mm;
Min. Line Spacing: 0.15mm;
Surface Treatment: Yellow;
Lead Time: 5-7 Working Days;
Small Order: Accepted;
PCB Name: FPC Printed Circuit Board Rigid Flex PCB & PCBA;
Min Pad Size: 0.2mm;
Pattern Registration Tolerance: +/-0.1mm--Working Panel Size: 250*300mm;
CNC Drill (Min): Flex:;0.15mm;
Min Line Width / Spacing: 0.075/0.075mm;
CNC Drill Size (Max): 6.5mm;
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Structure: Multilayer FPC;
Material: Fiberglass Epoxy, Polyester Film;
Combination Mode: Adhesive Flexible Plate;
Application: Aviation and Aerospace, Consumer Electronics;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V2, V0;
Processing Technology: Delay Pressure Foil, Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Type: Rigid Circuit Board;
Mechanical Rigid: Rigid;
Dielectric: Fr4 and Polyimide, Fr-4;
Board Material: Fr4 and Polyimide;
Board Layer: 2 Layer Rigide and 2 Layer Flex;
Copper Thickness: 1 Oz;
Min. Line Space: 0.05mm (2mil);
Min Conductor Width: 0.05mm(2mil);
Min.Hole Size: 0.075mm (3mil);
Surface Finishing: Enig, Immersion Tin, Immersion Gold. OSP;
Lead Time: 5-6 Working Days;
PCB Design: Customer Provided;
Board Thickness: 0.1mm;
Min Pad: +/-0.1mm (4mil);
Outline Machining Accuracy: +/-0.1mm (4mil);
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Structure: Multilayer FPC;
Material: Fiberglass Epoxy, Polyester Film;
Combination Mode: Adhesive Flexible Plate;
Application: Aviation and Aerospace, Consumer Electronics;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V2, V0;
Processing Technology: Delay Pressure Foil, Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Type: Rigid Circuit Board;
Mechanical Rigid: Rigid;
Dielectric: Fr4 and Polyimide, Fr-4;
Board Material: Fr2 and Polyimide;
Board Layer: 2 Layer Rigide and 2 Layer Flex;
Copper Thickness: 1 Oz;
Min. Line Space: 0.05mm (2mil);
Min Conductor Width: 0.05mm(2mil);
Min.Hole Size: 0.075mm (3mil);
Solder Mask: Any Color;
Silkscreen: Any Color;
Surface Finishing: Enig, Immersion Tin, Immersion Gold. OSP;
Lead Time: 5-6 Working Days;
PCB Design: Customer Provided;
Board Thickness: 0.1mm;
Min Pad: +/-0.1mm (4mil);
Outline Machining Accuracy: +/-0.1mm (4mil);
MOQ: 1 PCS;
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