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Flexible Printed Circuit Board FPC Assembly Multi-Layer FPC for Electronics Telecommunication Video

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.50-10.00 / Piece

Sepcifications

  • Structure Multilayer FPC
  • Material Copper
  • Combination Mode Adhesive Flexible Plate
  • Application Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace
  • Flame Retardant Properties V0
  • Processing Technology Des
  • Base Material Polyimide
  • Insulation Materials Polyimide
  • Brand Flex Plus
  • Transport Package Vacuum Package with Foam Protection & Carton
  • Specification Customized
  • Trademark Flex Plus
  • Origin China
  • Copper Thickness 1/3 Oz ~2 Oz
  • Length Max. 4m (XL Exposure Machine)
  • Line Width Min 0.05mm
  • Color Yellow, Green
  • Sample Delivery 3~5days
  • MP Delivery 7~10days
  • Soler Mask Allignment Tolerance 4mil
  • Silkscreen Alignment Tolerance 6mil
  • Layer 2+2

Product Description

Company Profile Established in 2004, Flex Plus (Xiamen) Co., Ltd. is dedicated in high-quality &cost effective flexible printed circuit board (Flex PCB) R&D, manufacturing and sales. To effectively respond to the technological expectations of its customers and satisfy the different market needs, ...

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FPC Comparison
Transaction Info
Price US$0.50-10.00 / Piece US$0.01-100.00 / pcs US$0.10-20.00 / Piece US$0.01-100.00 / pcs US$8.20-8.32 / Piece
Min Order 1 Piece 1 pcs 1 Piece 1 pcs 1 Piece
Payment Terms LC, T/T LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union LC, T/T, D/P, PayPal, Western Union, Small-amount payment
Quality Control
Management System Certification ISO9001:2015, Others - - - -
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Europe, Southeast Asia/ Mideast
Annual Export Revenue - - - - -
Business Model ODM, OEM - - - -
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Structure: Multilayer FPC;
Material: Copper;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Flame Retardant Properties: V0;
Processing Technology: Des;
Base Material: Polyimide;
Insulation Materials: Polyimide;
Brand: Flex Plus;
Copper Thickness: 1/3 Oz ~2 Oz;
Length: Max. 4m (XL Exposure Machine);
Line Width: Min 0.05mm;
Color: Yellow, Green;
Sample Delivery: 3~5days;
MP Delivery: 7~10days;
Soler Mask Allignment Tolerance: 4mil;
Silkscreen Alignment Tolerance: 6mil;
Layer: 2+2;
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Board Thickness: 0.2mm;
Layers: 1-2;
Copper Thickness: 35 Um;
Surface Finish: Enig;
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Layers: 4;
Type: Rigid+Flex;
Copper Thick: 1oz;
Board Thick: 1.0mm+0.2mm;
Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Layers: 1~2 Layers;
Board Thickness: 0.2mm;
Copper Thickness: 35 Um;
Surface Finish: Enig;
Outline: Module Punch;
Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Polyimide;
Insulation Materials: Epoxy Resin;
Board Material: Polyimide;
Board Layer: 2;
Board Thickness: 0.1 mm;
Copper Thickness: 1 Oz;
Solser Mask: Yellow;
Silkscreen: White;
Surface Finishing: Enig;
Shipping Type: DHL.TNT, EMS, FedEx, UPS etc;
PCB Design: Customized Product;
CNC Drill Size (Max): 6.5mm;
Lead Time: 4-5 Working Days;
CNC Drill (Min): Flex:160;0.15mm;
Min Line Width / Spacing: 0.075/0.075mm;
Pattern Registration Tolerance: +/-0.1mm--Working Panel Size: 250*300mm;
Min Pad Size: 0.2mm;
Supplier Name

Flex Plus(Xiamen) Co., Ltd

Gold Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Fastline Circuits Co., Limited

Diamond Member Audited Supplier

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