Miss Roen Lei
Sales Representative
Overseas Sales Department
Address:
5f, W2-A Block South 1 Road,Hi-Tech Industrial Park, Shenzhen, Guangdong, China
Telephone:
Zip Code:
Fax:
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Account Registered in:
2008
Business Range:
Electrical & Electronics
Business Type:
Manufacturer/Factory
Main Products:
Pcb Design, Pcb, Pcba
Company Introduction
Production Capacity
King Brother, leading provider for value-added service in electronic interconnect technology
Technical Capability:
Layer coverage: 2-20 layers
Thickness: 0.4-3.0mm
Solder mask: Green, black, red, yellow, white
Min. Line width / space: 3 mils / 3mils (0.075mm / 0.075mm)
Min. Hole diameter: 4 mils (0.1mm)
Max board thinkness: 6.0 mm
Max. Copper Weight: Inner layer 5oz (175um), ...
Technical Capability:
Layer coverage: 2-20 layers
Thickness: 0.4-3.0mm
Solder mask: Green, black, red, yellow, white
Min. Line width / space: 3 mils / 3mils (0.075mm / 0.075mm)
Min. Hole diameter: 4 mils (0.1mm)
Max board thinkness: 6.0 mm
Max. Copper Weight: Inner layer 5oz (175um), ...
King Brother, leading provider for value-added service in electronic interconnect technology
Technical Capability:
Layer coverage: 2-20 layers
Thickness: 0.4-3.0mm
Solder mask: Green, black, red, yellow, white
Min. Line width / space: 3 mils / 3mils (0.075mm / 0.075mm)
Min. Hole diameter: 4 mils (0.1mm)
Max board thinkness: 6.0 mm
Max. Copper Weight: Inner layer 5oz (175um), outer layers 7oz (245um)
Min. Blind-via: 8 mils (0.2mm)
Min. Buried-via: 8 mils (0.2mm)
Impedance Control: +/- 10%
Surface treatment: Immersion gold, Immersion tin, Electrolytic Ni/Au,
Gold finger, OSP, HAL, Lead free HAL
Base material: FR-4, SHENGYI S1130/S1141/S1170, HIGH TG: 130, 170
High-power: Aluminum base(Bergquist); Thick copper (3oz-6oz);
BT: (CookSon/GI-180, Nelco)
High frequency: Rogers: 4003/4350/5870/5880/6002/6010;
Taconic: RF35A/TacPreg/TacLam, Arlon: 25N / 25FR
Special Iaminate: Flexible printing board (Taiflex, Microcosm, Flex); Pi(Flex)
CCL material component-free: Ohmg
Lead time: Two to ten days
Technical Capability:
Layer coverage: 2-20 layers
Thickness: 0.4-3.0mm
Solder mask: Green, black, red, yellow, white
Min. Line width / space: 3 mils / 3mils (0.075mm / 0.075mm)
Min. Hole diameter: 4 mils (0.1mm)
Max board thinkness: 6.0 mm
Max. Copper Weight: Inner layer 5oz (175um), outer layers 7oz (245um)
Min. Blind-via: 8 mils (0.2mm)
Min. Buried-via: 8 mils (0.2mm)
Impedance Control: +/- 10%
Surface treatment: Immersion gold, Immersion tin, Electrolytic Ni/Au,
Gold finger, OSP, HAL, Lead free HAL
Base material: FR-4, SHENGYI S1130/S1141/S1170, HIGH TG: 130, 170
High-power: Aluminum base(Bergquist); Thick copper (3oz-6oz);
BT: (CookSon/GI-180, Nelco)
High frequency: Rogers: 4003/4350/5870/5880/6002/6010;
Taconic: RF35A/TacPreg/TacLam, Arlon: 25N / 25FR
Special Iaminate: Flexible printing board (Taiflex, Microcosm, Flex); Pi(Flex)
CCL material component-free: Ohmg
Lead time: Two to ten days
Factory Address:
5f, W2-A Block South 1 Road,Hi-Tech Industrial Park, Shenzhen, Guangdong, China
