1. Product profile
KID-R800 is a small-sized rework station but can desolder and solder Max. PCB size 630x630mm; With optical alignment system and hot air & IR mixing heating way; Controlled by software; Motor drive for all operations.

2. Features
1) 6-axis linkage, driven by 7 electric motors; Rocker control for air head/PCB and optical alignment system motions in X/Y axis, easy operation; With memory function; Suitable for mass repair, high efficiency; High automation degree.
2) Hot air head and mounting head integration design, with auto soldering and desoldering functions.
3) Upper/lower heaters adopt Hot air & IR mix heating. Upper heater uses two-path and direct-injection way. IR acts on the heating area directly; In the meanwhile, hot air works. They interact to heat quickly, and keep temperature even. (heating-up speed is up to 10° C/S)

4) Independent 3 heaters, upper and lower heaters can realize linkage and move within bottom pre-heating area along X/Y axis. Lower heater can move up/down and support PCB, auto-controlled by motors. The upper and lower heater able to move towards target BGA, without moving PCB.
5) Unique bottom preheating table made of Germany-imported good quality heating materials "plated IR tube" & constant temperature glass "anti-dazzle" (heat-resist up to 1800° C), pre-heating area up to 500*420mm.
6) Preheating table, clamping device and cooling system can move integrally in X axis that make PCB locating & desoldering safer and conveniently.
7) The unique design of integral movement in X/Y axis, make the best of space.; Small-sized device accomplishes big PCB rework needs; Max. PCB size up to 630*610mm; No rework dead space.
8) Initiative: Quick Location" system and rocker location method make locating more quick and convenient.

9) The clamping device with locating scales; System can memorize previous locating scales that makes repetitive locating very quick and convenient.
10) Auto-place BGA chips on jigs with locating scales.
11) Inbuilt vacuum pump, rotatable 360° In Φ Angle, step motor drive, with memory function; Fine-adjusting mounting suction nozzle.
12) Suction nozzle can detect BGA pickup and mounting height automatically with pressure controllable within 10 grams; "zero" pressure available to smaller BGA pickup and mounting.

13) Color high-resolution optical vision system, with split vision, zoom in and fine-adjusting functions, aberration distinguish device included, auto-focus, software operation 22x optical zoom; Reworkable max. BGA size: 70&70mm.
14) Embedded industrial computer, touch screen interface, PLC control with real-time temperature profile display; Both setting profile and real temperature profile can be displayed;
15) Upper/lower heater with 10 segments of temperature up (down) and 10 segments of constant temperature control, industrial computer can save temperature profiles without limit; Can analysis profiles on the touch screen.
16) Many sizes of alloy nozzle, easy for replacement; Can locate at all angle.
17) With 5 thermocouple ports, can real-time detect and analyze temperatures at multipoint.
18) Equipped with two independent air supply,

3. Technical parameters
1) Model No: KID-R800
2) Max. PCB size: L630*W610mm
3) PCB thickness: 0.5~5mm
4) Applicable BGA size: 1*1~70*70mm
5) Min ball pitch: 0.15mm
6) Max. Weight of BGA: 150g
7) Placement accuracy: ± 0.01mm
8) PCB locating way: Outer or location hole
9) Temperature control way: K-type thermocouple, close loop control
10) Lower heater: IR+Hot air 800W
11) Upper heater: Hot air 1200W
12) Bottom preheating: IR 6000W
13) Power: Three phase 380V\50/60Hz
14) Machine size: L970*W700*H1400mm(exclude frame)
15) Machine weight: Approx. 170KG

4\Standard accessories
1)Irregular PCB jig
2)Alloy hot air nozzle
3)2 barrier chips(reduce preheating area)
4)Solder flux
5)Solder ball
6)Solder ball table
7)Hexagon spanner