1. Product profile
KID-R750 is a small-sized rework station but can desolder and solder Max. PCB size 630x630mm; With optical alignment system and hot air & IR mixing heating way; Controlled by software.

2. Features
1) Hot air head and mounting head integration design, with auto soldering and desoldering functions.
2) Upper/lower heaters adopt Hot air & IR mix heating. Upper heater uses two-path and direct-injection way. IR acts on the heating area directly; In the meanwhile, hot air works. They interact to heat quickly, and keep temperature even. (heating-up speed is up to 10° C/S)
3) Independent 3 heaters, upper and lower heaters can realize linkage and move within bottom pre-heating area along X/Y axis. Lower heater can move up/down and support PCB, auto-controlled by motors. The upper and lower heater able to move towards target BGA, without moving PCB.
4) Unique bottom preheating table made of Germany-imported good quality heating materials "plated IR tube" & constant temperature glass "anti-dazzle" (heat-resist up to 1800° C), pre-heating area up to 500*420mm.

5) Preheating table, clamping device and cooling system can move integrally in X axis that make PCB locating & desoldering safer and conveniently.
6) The unique design of integral movement in X/Y axis, make the best of space.; Small-sized device accomplishes big PCB rework needs; Max. PCB size up to 630*610mm; No rework dead space.
7) Inbuilt vacuum pump, rotatable 360° In Φ Angle; Fine-adjusting mounting suction nozzle.
8) Suction nozzle can detect BGA pickup and mounting height automatically with pressure controllable within 10 grams; "zero" pressure available to smaller BGA pickup and mounting.
9) Color high-resolution optical vision system, movable by hand in X/Y axis, with split vision, zoom in and fine-adjusting functions, aberration distinguish device included, auto-focus, software operation, 22x optical zoom; Reworkable max. BGA size 70*70MM;

10) Embedded industrial computer, touch screen interface, PLC control with real-time temperature profile display; Both setting profile and real temperature profile can be displayed;
11) Upper/lower heater with 10 segments of temperature up (down) and 10 segments of constant temperature control, industrial computer can save temperature profiles without limit; Can analysis profiles on the touch screen.
12) Many sizes of alloy nozzle, easy for replacement; Can locate at all angle.
13) With 5 thermocouple ports, can real-time detect and analyze temperatures at multipoint.
14) Equipped with two independent air supply, can connect with Nitrogen or compressor air, or interchange them, makes desoldering safer and more reliable.
Optional functions:
1) Can keep longtime 30° C difference between the heating area and border area to protect small BGA around from melting; Special for the glued BGAs of cell phone and laptop.
2) Can upgrade to KID-R760 with the additional function of suction nozzle rotatable in 360° ; Controlled by step motor and the rotating angles can be memorized.

3. Technical parameters
1) Model No.: KID-R750
2) Max. PCB size: W630*D610mm
3) PCB thickness: 0.5-5mm
4) Applicable BGA: 1*1 _ 70*70mm
5) Min. Ball pitch: 0.15mm
6) Max. Weight of BGA: 150g
7) Placement precision: ± 0.01mm
8) PCB locating way: Outer or location hole

9) Temperature control way: K-type thermocouple, close loop control
10) Lower heater: IR+hot air 800W
11) Upper heater: Hot air 1200W
12) Bottom pre-heating: IR 6000W
13) Power: Three-phrases 380V, 50/60Hz
14) Machine size: L970*W700*H830mm (exclude frame)
15) Machine weight: Approx. 130KG

4. Standard accessories
1) Irregular jigs
2) Alloy hot air nozzles
3) 2 barrier chip (reduce pre-heating area)
4) Paste flux
5) Solder balls
6) BGA Reball kits
7) Internal hexagonal wrench