Automatic optics vision system BGA rework station R600

1. Product profile
KID-R600 is a rework station with optical alignment system, and the integration of soldering and desoldering design; Applicable to BGAs of all forms of encapsulation.

2. Features
1)Hot air head and mounting head integration design, step motor drive, with auto soldering and desoldering functions.
2)New-style hot air and IR mixed 2 in 1 for upper head heating; Temperature rises fast, which leads to the big temperature difference between BGA and others around with no effects on them; Suitable for PCB with small pitch between components.
3)Three separate heating areas, upper/lower hot air and bottom IR; Heating time and temperature can display on the touch screen.
4)Large movable bottom pre-heating area, PCB clamping device can be flexibly adjusted on X/Y-axis; Reworkable Max. PCB size 550*550mm.
5)Powerful cross flow fan cools down the lower heating areas quickly.
6)Color high-resolution optical vision system with split vision, zoom in and fine-adjusting functions, aberration distinguish device included, auto-focus, software operation, 22x optical zoom, reworkable BGA size range 1.5 * 1.5 mm ~70*70mm.
7)Embedded industrial computer, touch screen interface, PLC control with real-time temperature profile display; Both setting profile and real temperature profile can be displayed.
8)Inbuilt vacuum pump, rotatable 60° In Φ Angle, fine-adjusting mounting suction nozzle.
9)Upper/lower heater with 8 segments of temperature up (down) and 8 segments of constant temperature control, industrial computer can save temperature profiles without limit; Can analysis profiles on the touch screen.
10)Suction nozzle can detect mounting height automatically with pressure controllable within tiny extent.
11)Many sizes of alloy nozzle, easy for replacement; Can locate at all angle.
12)Color optical vision system manually operated.
13)Auto-place BGA chips on jigs with locating scales.
14)Equipped with thermocouple port, real-time temperature monitoring and analyzing functions.

3. Technical parameter
1)Model No: KID-R600
2)Max PCB size: L550*W500mm
3)PCB thickness: 0.5~5mm
4)Applicable BGA: 1*1~70*70mm
5)Min. Ball pitch: 0.15mm
6)Max. Weight of BGA: 150g
7)Placement accuracy: ± 0.01mm
8)PCB locating way: Outer
9)Working table adjustable: Forward/backward ± 15mm, left/right ± 15mm
10)Temperature control way: K-type thermocouple, close loop control
11)Lower hot heater: Hot air 800W
12)Upper hot heater: IR+ hot air 1200W
13)Bottom pre-heating: IR 3600W
14)Power: Single-phase 220V\50/60Hz
15)Machine size: L850*W750*H630mm
16)Machine weight: Approx. 80KGS

4. Standard Accessories
1)Standard nozzles: 5PCS (An extra nozzle that is available to auto-take BGA and suitable for desoldering multilayer BGA. It is at extra cost)
2)Lower big nozzle: 1PC; Small nozzle: 1PC
3)Allen wrench: 1set
4)User manual: 1PC
5)Brush: 1PC
6)Suction nozzle: 1PC
7)Thermocouple: 1PC
8)Mouse: 1PC
9)Aluminum plate: 1PC