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Mr. Jesse Chen
Address:
Room 2004, Building a, Zhongqiao Mansion, No. 162 Qifeng Road, Guancheng Subdistrict, Dongguan, Guangdong, China
Telephone:
Zip Code:
Fax:
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Account Registered in:
2025
Business Range:
Computer Products, Consumer Electronics, Electrical & Electronics
Management System Certification:
ISO 9001
Business Type:
Manufacturer/Factory
Main Products:
Wafer Production Sales and Contract Processing, Chip Design Production Sales and Contract Man
Company Introduction
Production Capacity
Guobiao New Materials, and adopts the CIDM model along with international ESG standards,
Focused on the development of semiconductor wafer processes and chip processes; The company is the first in the world to achieve six major crystal
Round substrate through-hole (TPV/TSV/TSICV/TGV/TCV/GB-TSCDV) process and generation
The company is an industrial enterprise and one of the six major ...
Focused on the development of semiconductor wafer processes and chip processes; The company is the first in the world to achieve six major crystal
Round substrate through-hole (TPV/TSV/TSICV/TGV/TCV/GB-TSCDV) process and generation
The company is an industrial enterprise and one of the six major ...
Guobiao New Materials, and adopts the CIDM model along with international ESG standards,
Focused on the development of semiconductor wafer processes and chip processes; The company is the first in the world to achieve six major crystal
Round substrate through-hole (TPV/TSV/TSICV/TGV/TCV/GB-TSCDV) process and generation
The company is an industrial enterprise and one of the six major wafer suppliers; Its process technology has broken through bottlenecks
Moreover, the product can achieve domestic production and import substitution, meeting the requirements of aviation, electronics, instrumentation, and military industries
Demand.
The company's overseas team, primarily composed of members from Taiwan, Japan, and South Korea, consists of over 20 people, with 6 full-time sales staff from mainland China, particularly in the field of craftsmanship
Material engineers, equipment and production technicians have over 15 years of experience in their respective fields, among them
Doctors account for 60%; Company in
TPV/TSV/TSICV/TGV/TSCDV/TAMBV/ALD/CMP/BCD/ECP/RDL/
GAAFET/FinFET/LDD/DDD/SOI/SIP/HBM/CPO/STI/3D-4D heterogeneous integration
Process technologies such as forming, bonding, etching, electroplating, deposition coating, wafer metallization, wafer back-gold, and masking
Leading internationally, achieving nanoscale precision, and featuring globally unique GB-TSCDV/TSCDBV
Process technology; Companies and related research institutes, domestic universities, domestic research institutes, overseas institutions
Large enterprises in overseas industries and related sectors have established extensive cooperation and business relationships. Company in
Conductor automotive chips, quantum chips, AI chips, and others are being developed to facilitate the industrialization of BAT-AI.
Focused on the development of semiconductor wafer processes and chip processes; The company is the first in the world to achieve six major crystal
Round substrate through-hole (TPV/TSV/TSICV/TGV/TCV/GB-TSCDV) process and generation
The company is an industrial enterprise and one of the six major wafer suppliers; Its process technology has broken through bottlenecks
Moreover, the product can achieve domestic production and import substitution, meeting the requirements of aviation, electronics, instrumentation, and military industries
Demand.
The company's overseas team, primarily composed of members from Taiwan, Japan, and South Korea, consists of over 20 people, with 6 full-time sales staff from mainland China, particularly in the field of craftsmanship
Material engineers, equipment and production technicians have over 15 years of experience in their respective fields, among them
Doctors account for 60%; Company in
TPV/TSV/TSICV/TGV/TSCDV/TAMBV/ALD/CMP/BCD/ECP/RDL/
GAAFET/FinFET/LDD/DDD/SOI/SIP/HBM/CPO/STI/3D-4D heterogeneous integration
Process technologies such as forming, bonding, etching, electroplating, deposition coating, wafer metallization, wafer back-gold, and masking
Leading internationally, achieving nanoscale precision, and featuring globally unique GB-TSCDV/TSCDBV
Process technology; Companies and related research institutes, domestic universities, domestic research institutes, overseas institutions
Large enterprises in overseas industries and related sectors have established extensive cooperation and business relationships. Company in
Conductor automotive chips, quantum chips, AI chips, and others are being developed to facilitate the industrialization of BAT-AI.
Factory Address:
Room 2004, Building a, Zhongqiao Mansion, No. 162 Qifeng Road, Guancheng Subdistrict, Dongguan, Guangdong, China
R&D Capacity:
OEM, ODM, Own Brand()
No. of R&D Staff:
11-20 People
No. of Production Lines:
3
Annual Output Value:
US$1 Million - US$2.5 Million
Ever Annual Output of Main Products:
| Product Name | Units Produced (Previous Year) |
|---|---|
| Wafer, chip | 3000000 Pieces |