Brief Introduction
 
This is a combined machine for Dual Interface Bank Card production, integrating functions of cavemilling, chip punching, hot-melt tape lamination, chip embedding and chip detection in one processingcircle.
Specifically designed with two technologies combined in one machine, they are Solder pasteTech and ACF Tech.

It is a High Speed machine, Switch the technologies by changing some tools and setting on the HMITransfer cards to next station by auto, operator friendly.Function stations: Card loading, Color Sensor Detection, Double Card Detection, Milling Stations,Cleaning, Depth Detection, Antenna conduction detection,Perforation Detection, Glue dispensing,Glue size detection, Embedding, Chip Presence Detection, Tape Punching, Online Lamination, HotPress, Cold Press, Module Flatness Detection, ATR Detection, ATS Detection, Frequency and Qreader, Module OCR Inspection.

Features
* Large capacity feeding magazine (Max 3000pcs)
* Card feeding by autoControl by servo driver
* Cards be transferred by servo belt in the processing, safety and stable.
* Milling heads was control by Two groups of X, Y, Z axis, 
* Works on card body's first layer andsecond layer separately, which improve the accuracy and efficiency.
* Inlay depth detection by a special designed sensor, milling head performed on the card accordingthe depth of the inlay, avoid damaging the inlay and improved the yield.
* Panasonic servo system,
* THK lead screw,
* XYZ axis to control the processing in the embeddingstation
* OCR cameras to detect the glue size and chip surface
* ATR/ATS detection from HID
* Rejected cards be collected separately during the processing
* Setting on HMI, operator friendly
* Frequency and Q reader from Rigol