Chengliankaida (Hebei)Technology Co., Ltd was founded in 2007 with its headquarters in Tongzhou district, Beijing, covering an area of 20000 square meters. With the company's fast development, in early 2023, our Zunhua factory was put into operation and covers an area of 35000 square meters.

As a high-tech enterprise, we focus on researching and developing a series of Vacuum soldering system solution and production lines for semiconductor electronic device packaging. We adhere to the core concept of "Innovation&Intelligence&Creativity, &Responsibility" guides us to study domestic and foreign advanced experiences, fully research and development the soldering technology to solve problems of high void rate and hermetic packaging and so on. With more and more customers using our equipment, we getting more high praise from the users.

At the same time, we also established a research and development center with the IGBT industry alliance and various universities and institutes committed to the development of the packaging of power module devices and semiconductor electronic devices. We have achieved a series of accomplishments, including 15 practical patents, software patents, design patents, and currently, more than 25 patents are in the process of being applied for. We will continue to innovate, constantly upgrade our products, increase technology and process development, and strive to become an internationally renowned equipment enterprise.