Product List
(Total 12 Products )
View:
List View
Gallery View
Min. Order: 10 Pieces
- Type: Combining Rigid Circuit Board
- Dielectric: PTFE+Fr4
- Material: PTFE+Fr4
- Application: Consumer Electronics
- Flame Retardant Properties: V0
- Mechanical Rigid: Rigid
Min. Order: 10 Pieces
- Type: Rigid Circuit Board
- Dielectric: PTFE
- Material: PTFE
- Flame Retardant Properties: V0
- Mechanical Rigid: Rigid
- Processing Technology: Electrolytic Foil
Min. Order: 10 Pieces
- Type: Rigid Circuit Board
- Dielectric: FR-4
- Material: Fiberglass Epoxy
- Application: Consumer Electronics
- Flame Retardant Properties: V0
- Mechanical Rigid: Rigid
Min. Order: 10 Pieces
- Type: Rigid Circuit Board
- Dielectric: FR-4
- Material: Fiberglass Epoxy
- Flame Retardant Properties: V0
- Mechanical Rigid: Rigid
- Processing Technology: Electrolytic Foil
Min. Order: 10 Pieces
- Type: Hermal Clad Metal Core PCB
- Flame Retardant Properties: V2
- Dielectric: Thermal Conductivity
- Base Material: Copper
- Insulation Materials: Thermal Conductivity
- Processing Technology: Copper Base PCB
Min. Order: 10 Pieces
- Insulation Materials: Pi+Fr4
- Flame Retardant Properties: V0
- Application: Tws Headset
- Transport Package: Vacuum Packing
- Specification: 160.4mm× 163.2mm
- Trademark: YMS
Min. Order: 10 Pieces
- Type: Rigid Circuit Board
- Dielectric: FR-4
- Material: Fiberglass Epoxy
- Application: LED Display Screen
- Flame Retardant Properties: V0
- Mechanical Rigid: Rigid
Min. Order: 10 Pieces
- Structure: Multilayer FPC
- Material: Polyimide
- Combination Mode: Without Adhesive Flexible Plate
- Application: Digital Products
- Conductive Adhesive: Anisotropic Conductive Adhesive
- Flame Retardant Properties: V0
Min. Order: 10 Pieces
- Structure: Multilayer Rigid PCB
- Dielectric: High Speed Fr4
- Material: Low Dk Df
- Application: Optical Module
- Flame Retardant Properties: V0
- Processing Technology: RTF
Min. Order: 10 Pieces
- Type: Combining Rigid Circuit Board
- Flame Retardant Properties: V0
- Dielectric: Thermal Conductivity
- Base Material: Aluminum
- Insulation Materials: Thermal Conductivity
- Processing Technology: Delay Pressure Foil
Min. Order: 10 Pieces
- Type: Rigid Circuit Board
- Dielectric: FR-4
- Material: Fiberglass Epoxy
- Application: Communication
- Flame Retardant Properties: V0
- Mechanical Rigid: Rigid
Min. Order: 10 Pieces
- Type: Rigid Circuit Board
- Dielectric: FR-4
- Material: Fiberglass Epoxy
- Flame Retardant Properties: V0
- Mechanical Rigid: Rigid
- Processing Technology: Electrolytic Foil