Speaking about the loading and unloading units, which serve to automatically supply and stack the wafers, the optimized gripper and transfer unit for the size, weight and material of the wafers are used to supply and discharge the wafers.

EMC supplied onto the wafer can be discharged with the fixed amount within 0.2g, and employs the compression molding method. The molding unit is capable to manage the molding process at the level of the thickness and flatness of 10μ M, and the warpage of 500μ M or under. Molding condition is determined using the PID control method, and the molding pressurization profile pressurizes via a total of 15 stages. Pressing mode, using the 4 axis individual motor torque system, is designed to be able to offset the left/right/front/back flatness errors, and has the two press structure that can simultaneously process two wafers. Molding press has the maximum output force of 80 tons, and is available to set the curing time from at least 5 minutes to 30 minutes. The standard curing time is set at 10 minutes, and the UPH is 10 wafers.