High-Speed Precision Complex High-Performance Miniaturized Devices Requirements ...
Min. Order: 1 Piece
- Metal Coating: Enig / HASL / OSP / Silver etc.
- Mode of Production: SMT / DIP / Customized
- Layers: From 2 Layers to 50 Layers
- Base Material: Fr4/ High Tg Fr4/ Metal Core / Cem
- Certification: RoHS, CCC, ISO
- Customized: Customized
- Shenzhen Core Hecheng Electronic Technology ...
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Diamond Member
- Guangdong, China
- ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949
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Express High Density Interconnector PCB Plating HDI PCB Printied Circuit Boards Supplier ...
- Structure: Multilayer Rigid PCB
- Dielectric: FR-4
- Material: Polyester Glass Fiber Mat Laminate
- Application: Communication
- Flame Retardant Properties: V0
- Processing Technology: Electrolytic Foil
HDI Anylayer Elic 12 Layers for Smartphone PCB
Min. Order: 1 Piece
- Structure: Multilayer Rigid PCB
- Dielectric: FR-4
- Material: Epoxide Woven Glass Fabric Laminate
- Application: Communication
- Flame Retardant Properties: V0
- Processing Technology: Electrolytic Foil
High Density Interconnector Microvia Multilayers PCB
- Type: Rigid Circuit Board
- Dielectric: FR-4
- Material: Fiberglass Epoxy
- Application: Communication
- Flame Retardant Properties: V0
- Mechanical Rigid: Rigid
Double Interconnector Pogo Pin Probes
Min. Order: 10000 Pieces
- Interface Type: HDR
- Operating Frequency: Low Frequency
- Support Card Number: All in One
- Material: Brass
- Gender: Male
- Poles: 2-8
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