| Specification |
Structure: Single-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: LED;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Pi;
Insulation Materials: Epoxy Resin;
Brand: UC;
Layer: 1;
Base Material Type: Polyimide;
Thickness: 0.15-0.2mm;
Size: 500*8mm;
Solder Mask Color: White/Black;
Surface Treatment: Immersion Gold;
Ipc Standards: Ipc Class II;
Lead Time: 6 Working Days;
PCB Testing: E-Testing, Flying Probe Testing;
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Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Xtz;
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Structure: Single-Sided FPC;
Material: Polyimide;
Combination Mode: Without Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace, Aviation and Aerospace, Consumer Electronics;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Polyimide;
Insulation Materials: Epoxy Resin;
Brand: Finestpcb;
TPE: FPC, FPCB, Flexible PCB;
Copper Thickness: 1oz / 1/2 O Z/ 1/3 Oz, 1oz;
Min. Line Width: 0.04mm;
Min. Hole Size: 0.1mm;
Min. Line Spacing: 0.04mm;
Board Size: Ustom;
Product Name: Flexible Printed Circuit Board;
Service: OEM Flex PCB Boards Services;
Solder Mask: Green. Red. Blue. White. Black;
Keyword: 1-4 Layer Flexible Circuit PCB;
Surface Treatment: Immersion Gold/OSP/Immersion Silver/Immersion Tin;
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Structure: Single-Sided FPC;
Material: Polyimide;
Combination Mode: Without Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace, Aviation and Aerospace,Consumer Electronics;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Polyimide;
Insulation Materials: Epoxy Resin;
Brand: Finestpcb;
TPE: FPC, FPCB, Flexible PCB;
Copper Thickness: 1oz / 1/2 O Z/ 1/3 Oz, 1oz;
Min. Line Width: 0.04mm;
Min. Hole Size: 0.1mm;
Min. Line Spacing: 0.04mm;
Board Size: Ustom;
Product Name: Flexible Printed Circuit Board;
Service: OEM Flex PCB Boards Services;
Solder Mask: Green. Red. Blue. White. Black;
Keyword: 1-4 Layer Flexible Circuit PCB;
Surface Treatment: Immersion Gold/OSP/Immersion Silver/Immersion Tin;
|
Structure: Single-Sided FPC;
Material: Polyimide;
Combination Mode: Without Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace, Aviation and Aerospace,Consumer Electronics;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Polyimide;
Insulation Materials: Epoxy Resin;
Brand: Finestpcb;
TPE: FPC, FPCB, Flexible PCB;
Copper Thickness: 1oz / 1/2 O Z/ 1/3 Oz, 1oz;
Min. Line Width: 0.04mm;
Min. Hole Size: 0.1mm;
Min. Line Spacing: 0.04mm;
Board Size: Ustom;
Product Name: Flexible Printed Circuit Board;
Service: OEM Flex PCB Boards Services;
Solder Mask: Green. Red. Blue. White. Black;
Keyword: 1-4 Layer Flexible Circuit PCB;
Surface Treatment: Immersion Gold/OSP/Immersion Silver/Immersion Tin;
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