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Fr4 PCB
US$0.20-1.00 / pieces
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What is Smart Electronics Custom Rigid-Flex Fr4 PCB Circuit Board Multilayer Printed Circuits Board Motherboard Manufacturer FPC in China

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

5-99 pieces US$1.00

100-999 pieces US$0.50

1,000+ pieces US$0.20

Sepcifications

  • Structure Multilayer FPC
  • Material Polyimide
  • Combination Mode Adhesive Flexible Plate
  • Application Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace
  • Conductive Adhesive Conductive Silver Paste
  • Flame Retardant Properties V0
  • Processing Technology Electrolytic Foil
  • Base Material Fr4
  • Insulation Materials Organic Resin
  • Brand Smart
  • Transport Package Carton
  • Specification custom
  • Trademark Smart
  • Origin Guangdong, China
  • Type FPC
  • Copper Thickness 0.3oz-3oz
  • Min.Hole Size 0.15mm
  • Basematerial Pi/Pet
  • Board Size Custom
  • Min.Line Width 0.075mm
  • Min.Line Spacing 0.075mm
  • Board Thickness 0.057-0.6mm
  • Surface Finishing Enig, Immersion Silver, OSP
  • Certificate RoHS/CE

Product Description

Serial Number Item Process Capability Tolerance 01 Number of layers 1-16 MAX:500X3000MM 02 Production plate size MAX:250X3000MM 0.08MM 03 Drilled Hole Diameter MIN:250X1500MM 0.03MM 04 Tolerance of drilled hole diameter 6.5MM/0.1MM 15-40UM 05 Copper thickness in hole ...

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Fr4 PCB Comparison
Transaction Info
Price US$0.20-1.00 / pieces US$2.00 / Piece US$2.00 / Piece US$1.00 / Piece US$1.00 / Piece
Min Order 5 pieces 2 Pieces 2 Pieces 1 Piece 1 Piece
Payment Terms T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, Western Union, PayPal, Small-amount payment LC, T/T, D/P, Western Union, PayPal, Small-amount payment LC, T/T, D/P, Western Union, PayPal, Small-amount payment LC, T/T, D/P, Western Union, PayPal, Small-amount payment
Quality Control
Product Certification RoHS/CE - - - -
Management System Certification - - - - -
Trade Capacity
Export Markets North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia Southeast Asia/ Mideast Southeast Asia/ Mideast Southeast Asia/ Mideast Southeast Asia/ Mideast
Annual Export Revenue - - - - -
Business Model Own Brand, ODM, OEM Own Brand Own Brand Own Brand Own Brand
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Brand: Smart;
Type: FPC;
Copper Thickness: 0.3oz-3oz;
Min.Hole Size: 0.15mm;
Basematerial: Pi/Pet;
Board Size: Custom;
Min.Line Width: 0.075mm;
Min.Line Spacing: 0.075mm;
Board Thickness: 0.057-0.6mm;
Surface Finishing: Enig, Immersion Silver, OSP;
Structure: Multilayer FPC;
Material: Pi;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Cry;
Structure: Multilayer FPC;
Material: Pi;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Cry;
Structure: Multilayer FPC;
Material: Pi;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Cry;
Structure: Multilayer FPC;
Material: Pi;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Cry;
Supplier Name

Shenzhen Smart Electronics Co., Ltd

Diamond Member Audited Supplier

Shenzhen Chengruyuan Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Chengruyuan Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Chengruyuan Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Chengruyuan Technology Co., Ltd.

Diamond Member Audited Supplier

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