| Specification |
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: Fr4, Tg, Cem-1, Aluminium;
Customized: Customized;
Condition: New;
Layer: 1-24 Layers;
Material: Fr-4, High Tg, Isola, Aluminum, Rogers, etc;
Copper Thickness: 0.5-6.0oz;
Min. Hole Size: 0.1mm;
Min.Line Spacing: 0.075mm;
Min. Line Width: 0.15mm;
PCB Type: Rigid, Flexible, Rigid-Flexible;
Surface Finish: HASL, Lf HASL, Imm Gold, Imm Silver, OSP etc;
Solder Mask: Green, Red, White, Yellow, Blue, Black, Orange etc;
Board Thickness: 0.2-4.0mm;
|
Metal Coating: Custom;
Mode of Production: Custom;
Layers: Custom;
Base Material: Custom;
Customized: Customized;
Condition: New;
|
Mode of Production: DIP;
Layers: Double-Layer;
Customized: Non-Customized;
Condition: New;
Video Input: PAL/SDI;
Video Output: HDMI/SDI;
ROM: 128gbyte Emmc;
RAM: 8gbyte Lpddr4X;
Voltage: DC 12V;
Ai Feature: Detection and Recognition;
Image Enhancement: Stabilisation, Fusion, Stitching, Defog;
Operating Temperature: -40℃+60℃;
|
Mode of Production: DIP;
Layers: Double-Layer;
Customized: Non-Customized;
Condition: New;
Video Input: PAL/SDI;
Video Output: HDMI/SDI;
ROM: 128gbyte Emmc;
RAM: 8gbyte Lpddr4X;
Voltage: DC 12V;
Ai Feature: Detection and Recognition;
Image Enhancement: Stabilisation, Fusion, Stitching, Defog;
Operating Temperature: -40℃+60℃;
|
Metal Coating: Custom;
Mode of Production: Custom;
Layers: Custom;
Base Material: Custom;
Customized: Customized;
Condition: New;
|