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IC
US$1.50-10.00 / Piece
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What is IC Substrate Board Custom Fr-4 Circuit Board Multilayer PCB Printed Manufacturers IC Board

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$1.50-10.00 / Piece

Sepcifications

  • Type IC Substrate
  • Dielectric Bt
  • Material Bt
  • Application Consumer Electronics
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Bt
  • Insulation Materials Organic Resin
  • Brand Kevis
  • Transport Package Vacuum Packing/Blister/Plastic /Carton Box
  • Specification 20*18*0.5
  • Trademark KAIVESIN
  • Origin Guangzhou
  • Products Name IC Substrate Board Bt Substrate PCB
  • Layer Single / Double Sided / Multilayer
  • Service PCB/PCBA/PCB Assembly/Electronic Parts
  • Other Service Layout Design,Engineering Support,Testing
  • Specialised Medical,Industrial,Communication,Controlboard,LED
  • PCBA QC X-ray, Aoi Test, Function Test(100% Test),40X Om
  • Certificate ISO9001,ISO14001,ISO13485,Ts-16949,etc
  • Surface Finishing HASL, Enig, OSP, Lmmersion Au, AG,Sn
  • Copper Thickness 0.5oz/1oz/2oz/3oz/4oz
  • Min.Hole Size 0.1mm (4 Mil)
  • Board Thickness 0.2mm-7mm
  • Min.Line Spacing 0.1mm (4 Mil)
  • Solder Color Green, Red, White, Black,Yellow,Blue
  • SMT Assembly Line 10 Lines
  • Delivery PCB: 1-5 Days; PCB Assembly: 1-10 Days

Product Description

Title IC substrate board Custom FR-4 Circuit Board Multilayer PCB Printed Manufacturers IC board Product Parameters ltem Value Product name Kevis Manufacturer OEM PCB Circuit Board SMT PCB Assembly IC Substrate Board BT Substrate Model Number Printed Circuit Board , Development Board , ...

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IC Comparison
Transaction Info
Price US$1.50-10.00 / Piece US$0.20-20.00 / Piece US$0.56-5.00 / Piece US$0.76-5.00 / Piece US$0.98-5.00 / Piece
Min Order 1 Piece 10 Pieces 10 Pieces 10 Pieces 10 Pieces
Payment Terms T/T T/T T/T T/T T/T
Quality Control
Product Certification ISO9001,ISO14001,ISO13485,Ts-16949,etc RoHS, CCC, ISO RoHS, CCC, ISO RoHS, CCC, ISO RoHS, CCC, ISO
Management System Certification ISO14001, Others ISO9001:2015 ISO9001:2015 ISO9001:2015 ISO9001:2015
Trade Capacity
Export Markets North America, South America, Southeast Asia/ Mideast, East Asia(Japan/ South Korea) Domestic Domestic Domestic Domestic
Annual Export Revenue - - - - -
Business Model Own Brand, ODM, OEM ODM, OEM ODM, OEM ODM, OEM ODM, OEM
Average Lead Time Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: one month
Off Season Lead Time: one month
Peak Season Lead Time: one month
Off Season Lead Time: one month
Peak Season Lead Time: one month
Off Season Lead Time: one month
Peak Season Lead Time: one month
Off Season Lead Time: one month
Product Attributes
Specification
Type: IC Substrate;
Dielectric: Bt;
Material: Bt;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Bt;
Insulation Materials: Organic Resin;
Brand: Kevis;
Products Name: IC Substrate Board Bt Substrate PCB;
Layer: Single / Double Sided / Multilayer;
Service: PCB/PCBA/PCB Assembly/Electronic Parts;
Other Service: Layout Design,Engineering Support,Testing;
Specialised: Medical,Industrial,Communication,Controlboard,LED;
PCBA QC: X-ray, Aoi Test, Function Test(100% Test),40X Om;
Surface Finishing: HASL, Enig, OSP, Lmmersion Au, AG,Sn;
Copper Thickness: 0.5oz/1oz/2oz/3oz/4oz;
Min.Hole Size: 0.1mm (4 Mil);
Board Thickness: 0.2mm-7mm;
Min.Line Spacing: 0.1mm (4 Mil);
Solder Color: Green, Red, White, Black,Yellow,Blue;
SMT Assembly Line: 10 Lines;
Delivery: PCB: 1-5 Days; PCB Assembly: 1-10 Days;
Type: Customized;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Customized;
Processing Technology: Customized;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: OEM/ODM;
PCBA-Testing: X-ray, Aoi;
Processing: Electrolytic Foil;
SMT Capacity: >2 Million Points/Day;
DIP Capacity: >100K Parts/Day;
Min. Space of BGA: +/- 0.3mm;
Min.Pin Space of IC: 0.3mm;
Max.Precision of IC Assembly: 0.03mm;
Surface Finishing: Lead-Free HASL;
Number of Layers: 4-10 Layer;
Board Thickness: 1.6mm;
Type: Customized;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Customized;
Processing Technology: Customized;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: OEM/ODM;
PCBA-Testing: X-ray, Aoi;
Processing: Electrolytic Foil;
SMT Capacity: >2 Million Points/Day;
DIP Capacity: >100K Parts/Day;
Min. Space of BGA: +/- 0.3mm;
Min.Pin Space of IC: 0.3mm;
Max.Precision of IC Assembly: 0.03mm;
Surface Finishing: Lead-Free HASL;
Number of Layers: 4-10 Layer;
Board Thickness: 1.6mm;
Type: Customized;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Customized;
Processing Technology: Customized;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: OEM/ODM;
PCBA-Testing: X-ray, Aoi;
Processing: Electrolytic Foil;
SMT Capacity: >2 Million Points/Day;
DIP Capacity: >100K Parts/Day;
Min. Space of BGA: +/- 0.3mm;
Min.Pin Space of IC: 0.3mm;
Max.Precision of IC Assembly: 0.03mm;
Surface Finishing: Lead-Free HASL;
Number of Layers: 4-10 Layer;
Board Thickness: 1.6mm;
Type: Customized;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Customized;
Processing Technology: Customized;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: OEM/ODM;
PCBA-Testing: X-ray, Aoi;
Processing: Electrolytic Foil;
SMT Capacity: >2 Million Points/Day;
DIP Capacity: >100K Parts/Day;
Min. Space of BGA: +/- 0.3mm;
Min.Pin Space of IC: 0.3mm;
Max.Precision of IC Assembly: 0.03mm;
Surface Finishing: Lead-Free HASL;
Number of Layers: 4-10 Layer;
Board Thickness: 1.6mm;
Supplier Name

Guangzhou Kevis Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Hongzhou Smart Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Hongzhou Smart Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Hongzhou Smart Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Hongzhou Smart Technology Co., Ltd.

Diamond Member Audited Supplier

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