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Polymide Copper Foil Flex PCB Board Data Cable FPCB/FPC with Stiffener Video

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.01-150.00 / Piece

Sepcifications

  • Structure Single-Sided FPC
  • Material Polyimide
  • Combination Mode Adhesive Flexible Plate
  • Application Aviation and Aerospace
  • Conductive Adhesive Conductive Silver Paste
  • Flame Retardant Properties V0
  • Processing Technology Electrolytic Foil
  • Insulation Materials Organic Resin
  • Brand N/a
  • Transport Package Vacuum Packaging
  • Specification ISO9001& ISO14001& SGS& UL
  • Trademark ABIS CIRCUITS CO., LTD
  • Origin Made in China
  • Thickness 0.10mm
  • Cu 35um/35um
  • Surface Enig
  • Solder Mask Yellow
  • Stiffener Yes

Product Description

1-6 Layer Polymide Copper Foil Flex PCB Board Data Cable FPCB/FPC with Stiffener 1. Single, Double side &Multi-layer PCB. 2. Buried/Blind Vias, Via in Pad, Counter Sink Hole, Screw Hole(Counterbore), Press-fit, Half Hole. 3. HASL lead-free, Immersion Gold/ Silver/Tin, OSP, Gold plating/finger, ...

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FPC Board Comparison
Transaction Info
Price US$0.01-150.00 / Piece US$2.00-2.90 / Piece US$0.08-0.10 / Piece US$1.00-1.50 / Piece US$1.90-2.10 / Piece
Min Order 1 Piece 1 Piece 1 Piece 1 Piece 1 Piece
Payment Terms LC, T/T, PayPal, Western Union LC, T/T, D/P, PayPal, Western Union LC, T/T, D/P, PayPal, Western Union LC, T/T, D/P, PayPal, Western Union LC, T/T, D/P, PayPal, Western Union
Quality Control
Management System Certification - - - - -
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe
Annual Export Revenue - - - - -
Business Model - - - - -
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Structure: Single-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Insulation Materials: Organic Resin;
Brand: N/a;
Thickness: 0.10mm;
Cu: 35um/35um;
Surface: Enig;
Solder Mask: Yellow;
Stiffener: Yes;
Structure: Single-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Mobile Phone;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Polyimide;
Insulation Materials: Epoxy Resin;
Brand: Uc;
Layer: 4;
Thickness: 1.56mm;
Surface: HASL;
Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Computer with LCD Screen;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Polymide;
Insulation Materials: Organic Resin;
Brand: Uc;
Film Color: Yellow;
Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Medical Device;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Pi;
Insulation Materials: Epoxy Resin;
Brand: UC;
Board Thickness: 0.2mm;
Soldermask: Black;
Surface Finish: Enig;
Panel Size: 230*160;
Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Computer with LCD Screen;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Polymide;
Insulation Materials: Organic Resin;
Brand: UC;
Film Color: Yellow;
Board Thickness: 0.15mm;
Supplier Name

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

Diamond Member Audited Supplier

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